• Une nouvelle vidéo de l'Apple Park (MacBidouille)

    Voici la dernière vidéo en date de l'Apple Park prise par un drone.

    La surface de panneaux solaires installés est simplement hallucinante. Il y a probablement plus qu'assez d'énergie pour en redistribuer sur le réseau électrique local, tout du moins de jour quand l'ensoleillement sera important.

  • BlackBerry KEYOne Announced: Snapdragon 625 with QWERTY, $549 (AnandTech)

    This week at MWC, TCL announced the BlackBerry KEYOne, which follows in BlackBerry's traditional style with a distinctive hardware QWERTY keyboard, but this time a more polished look at an Android implementation. The KEYOne implements a high-capacity battery, Qualcomm’s Snapdragon 625 SoC, Android 7.1, a 4.5” LCD display, and a USB-C connector for power and data. The KEYone will arrive in April at around $549.

    Last year BlackBerry Limited announced its intention to quit from the development and the manufacturing of smartphones, deciding to focus on creating and licensing its brand, other IP, and primarily its secure software suite for mobile devices. TCL became the primary licensee of BlackBerry and this is a company that will produce BlackBerry-branded devices going forward. TCL is currently the only global licensee of the trademark, so this KEYOne is the first BlackBerry-branded device, aiming at similar markets to BlackBerry's previous products.

    The KEYone is not the first BlackBerry-branded handset from TCL (the TCL-developed DTEK50 device released in 2016 essentially uses the same platform as the Alcatel Idol 4 handset), but this if the first one that was developed to be a BlackBerry from the ground up and used a close collaboration with BlackBerry Limited for the design. So, while the KEYone is produced by TCL, engineers from BBL have added their touch to the product. In addition, the phone comes with pre-loaded software from BlackBerry, including the BlackBerry DTEK application that monitor’s phones security.

    One of the product messages surrounding the launch was that when BBL and TCL started development of the KEYone, they set themselves a number of goals they wanted to achieve: keep the BlackBerry heritage, offer fast connectivity over today’s networks, ensure a long battery life, snappy multitasking performance, and make the device sturdy, yet stylish. We're sure that the sales numbers wil be the marker for how well they succeed.

    First off, the quintessential value add for BlackBerry users has always been the physical keyboard, so this stays. TCL decided to add functionality to the keyboard beyond just typing, which is why the keyboard becomes an extension to the display as it supports swiping and programmable shortcuts. TCL lists that this functionality is useful for scrolling, photo editing, and opening apps (with various gestures).

    Battery life is a major concern of virtually all smartphone users. To make the KEYone last as long as possible, TCL did two things: it installed a ~3500 mAh battery into the handset and also picked up the Qualcomm Snapdragon 625 SoC. The S625 is an SoC we're going to see a lot of in 2017, as an alternative to S652 phones: rather than using 2xA72/4xA53 on 28nm, the S625 offers 8xA53 but on Samsung's 14nm LPP process, so while the latter might actually be lower in peak performance, the smaller node and lower power cores enable significant battery life improvements. On the connectivity side of things, the Snapdragon 625 supports 802.11ac, Bluetooth 4.2  and integrates Qualcomm’s X9 LTE modem (Cat 7 LTE, up to 300 Mbit/s downlink and up to 150 Mb/s uplink).

      BlackBerry KEYone Specifications
    SoC Qualcomm Snapdragon 625 (MSM8953)
    8x ARM Cortex-A53 @ 2.0 GHz
    Adreno 506
    RAM  3 GB LPDDR3
    Storage 32 GB (eMMC)
    Display 4.5-inch 1620x1080 (434 ppi) with Gorilla Glass 4
    2G: GSM/EDGE
    4G: depends on the version

    Canada, LATAM, APAC, US V1:
    LTE: 1, 2, 3, 4, 5, 7, 8, 12, 13, 17, 19, 20, 28, 29, 30
    TDD LTE: 38, 39, 40, 41

    LTE: 1, 2, 3, 4, 5, 7, 8, 13, 17, 20, 28
    TDD LTE: 38, 40

    US V2:
    LTE: 1, 2, 3, 4, 5, 7, 12, 13, 20, 25, 26, 28, 29, 30
    TDD LTE: 41
    CDMA: BC 0, 1, 10

    LTE Down: 300 Mb/s
    Up: 150 Mb/s
    Audio Stereo speakers
    3.5-mm TRRS audio jack
    Dimensions see pictures
    Rear Camera 12 MP with f/2.0 aperture and dual LED flash
    Front Camera 8 MP
    Battery 3505 mAh with Qualcomm's FastCharging 3.0
    OS Android 7.1
    Connectivity 802.11ac Wi-Fi, Bluetooth 4.1, USB-C
    Sensors Fingerprint, accelerometer, gyroscope, magnetometer, proximity, ambient light
    Navigation GPS, GLONASS (?)
    SIM Size NanoSIM
    Colors Black/Metallic
    Launch Country NA, EMEA (parts), APAC(?)
    Price $549/€599/£499

    The BlackBerry look is distinctive. There are virtually no phones with a keyboard today, and given the more modern design (compared to say, the Passport), this handset should stand out for more positive reasons. The keyboard uses stainless-steel strips between the rows for touch-type assistance and to aid the look. Since part of KEYone’s front panel is occupied by its QWERTY keyboard, the IPS display of the smartphone has a 3:2 aspect ratio in its 1620x1080 resolution, which is unusual for a smartphone.

    The KEYOne has a rather unique texture to the back of the device (the material TCL uses for the back side is unknown), which looks like processed leather or carbon fiber, but which is designed to be both sturdy and oleophobic. Moreover, this coating is designed to prevent the phone from slipping from hand during usage. As for the overall feel, the KEYone feels very solid, but its thickness is 0.37”, which is considerably thicker than that of most modern smartphones of comparable dimensions (Apple’s iPhone 7 is 0.28”, the iPhone 7 Plus is 0.29”). Part of this is down to the battery.

    When it comes to imaging, the BlackBerry KEYone uses Sony’s Exmor IMX378 and dual-tone flash as its primary camera as well as an 8 MP sensor (with selfie flash via LCD) on the front. Given the fact that the KEYOne is primarily targeting business users, nothing extra special was needed here.

    As for pricing and availability, the BlackBerry KEYone will hit the market in April in multiple countries at $549/€599/£499 price points. It's going to be interesting to see how many octo-A53 devices ever reach that price point.

  • Logic Supply ML100G-50 Fanless Skylake vPro Industrial NUC Review (AnandTech)

    Passively cooled computing systems carry many advantages. Most of these turn out to be very important for industrial and embedded applications. The low power nature of the NUCs make them the ideal candidate for passive industrial computing platforms. We have already reviewed a number of industrial PCs before. Today, we have an off-the-shelf passively cooled Skylake vPro PC in for review from Logic Supply. Read on for our thoughts on this unique industrial PC.

  • Windows 10 : la nouvelle préversion sans watermarking et date d'expiration (Génération NT: logiciels)
    La finalisation est imminente pour la mise à jour Creators Update de Windows 10. La nouvelle préversion (build 15042) en porte les stigmates.
  • Voler des données d'un ordinateur par la LED de son disque dur (Génération NT: logiciels)
    Un type d'espionnage de haut vol via un malware et un drone pour capter depuis l'extérieur des signaux optiques de la LED d'activité du disque dur d'un ordinateur.
  • Faille 0-day : Google récidive contre Microsoft (Génération NT: logiciels)
    Google divulgue publiquement une vulnérabilité sans patch affectant des produits de Microsoft (Edge et IE). La deuxième fois en un peu plus d'une semaine sous l'égide de Project Zero.
  • Sony Launches Xperia XZ Premium and Xperia XZs Phones For US Market (AnandTech)

    Sony announced today at MWC 2017 that it’s bringing two new premium phones to the US market: the Xperia XZ Premium and Xperia XZs. Both models employ classic Sony styling—a rectangular shape with rounded sides and a flat top and bottom. They also have an aluminum frame sandwiched between front and rear Gorilla glass panels.

    There are a few significant differences between the new Xperias. For starters, the XZ Premium will use Qualcomm’s latest Snapdragon 835 SoC, the first to use semi-custom ARM CPU cores and the first SoC available on Samsung’s new 10nm process. The XZs will use the previous generation Snapdragon 820, which uses four fully-custom Kryo CPU cores.

    New Sony Xperia XZ Series
      Sony Xperia XZ Premium Sony Xperia XZs
    SoC Qualcomm Snapdragon 835

    4x Kryo 280 Performance @ 2.45GHz
    4x Kryo 280 Efficiency @ 1.90GHz
    Adreno 540
    Qualcomm Snapdragon 820

    2x Kryo @ 2.15GHz
    2x Kryo @ 1.59GHz
    Adreno 530 @ 624MHz
    Display 5.5-inch 3840x2160 HDR IPS LCD 5.2-inch 1920x1080 IPS LCD
    Dimensions 156.0  x 77.0 x 7.9 mm
    195 grams
    146.0 x 72.0 x 8.1 mm
    161 grams
    NAND 64GB + microSD 32GB / 64GB + microSD
    Battery 3230 mAh
    2900 mAh
    Front Camera 13MP, 1/3.06" Sony Exmor RS, f/2.0 13MP, 1/3.06" Sony Exmor RS, f/2.0
    Rear Camera 19MP, 1/2.3" Sony Exmor RS 19MP, 1/2.3" Sony Exmor RS
    Modem Qualcomm X16 (Integrated)
    2G / 3G / 4G LTE (Category 16/13)
    Qualcomm X12 (Integrated)
    2G / 3G / 4G LTE (Category 9/13)
    SIM Size NanoSIM (Dual SIM option) NanoSIM (Dual SIM option)
    Wireless Wi-Fi, BT 4.2, NFC, GPS/Glonass Wi-Fi, BT 4.2, NFC, GPS/Glonass
    Connectivity USB 3.1 Type-C, 3.5mm headset USB Type-C, 3.5mm headset
    Additional Features QC 3.0 fast charging, IP68 environment protection, high-resolution audio, stereo front-facing speakers QC 3.0 fast charging, IP68 environment protection, high-resolution audio, stereo front-facing speakers
    Launch OS Android 7.1 Android 7.1

    The XZ Premium is the larger of the two with a 5.5-inch TRILUMINOS display, which is notable for being the first panel to combine 4K resolution with HDR image support. It will be interesting to see if the display runs at 4K all the time or just when watching 4K content, scaling back to 1080p otherwise. The XZs puts a 5.2-inch 1080p TRILUMINOS display into a smaller chassis. Both displays support Sony’s X-Reality picture engine and Dynamic Contrast Enhancement technology.

    Sealed inside the XZ Premium is 3230 mAh battery, which is a little smaller than I would like to see for a 5.5-inch class phone with a high-resolution 4K display. A smaller chassis means an even smaller battery for the XZs at 2900 mAh. Based solely on this information, I’m a little concerned about battery life, but we’ll have to wait until devices start shipping to see how long they last. Both phones at least support Qualcomm Quick Charge 3.0 fast charging.

    Xperia XZ Premium (left), Xperia XZs (right)

    In addition to 4GB of RAM, both phones also share some nice audio features, including support for high-resolution audio and stereo front-facing speakers. They also have an IP68 dust and water resistance rating, a feature Sony fans have grown accustomed to.

    It looks like both will have single and dual SIM versions. The dual SIM XZs comes with 64GB of internal storage like the XZ Premium, but the single SIM version only comes with 32GB. Storage can be expanded on all models with a microSD card.

    Xperia XZ Premium

    Both new XZ models use a similar camera configuration with a 13MP sensor behind an f/2.0 lens on the front and a 19MP sensor on the back. Both sensors are from Sony of course and are an integral part of the new Motion Eye camera system that incorporates technology from Sony’s a-series and Cyber-shot cameras, enabling 5x faster image scanning from the sensor. This means the Motion Eye cameras can capture super slow-motion video at an amazing 960fps (most phones are still stuck at 120fps or at most 240fps). The Predictive Capture feature starts buffering images when the camera detects motion, helping you capture fleeting moments you may have otherwise missed by allowing you to select from four photos taken up to 2 seconds before the shutter button was pressed. There’s also predictive hybrid autofocus that combines motion tracking and a motion prediction engine to lock onto an object and keep it in focus as it moves around.

    Xperia XZs

    The Xperia XZ Premium comes in two colors—Luminous Chrome and Deepsea Black—while the Xperia XZs offers three color options—Ice Blue, Warm Silver, and Black. The XZs will be available at select retailers, including Amazon and Best Buy, on April 5 for $699.99 (64GB). The XZ Premium will need to wait for the Snapdragon 835 SoC to become available, so it will not go on sale until later in the spring. Sony is not listing a price for it either, but it will most certainly cost more than the XZs.

  • Le retour du Nokia 3310 (MacBidouille)

    Si l'iPhone est sans aucun doute le smartphone le plus célèbre jamais vendu, avant lui il y a eu d'autres stars de la téléphonie mobile, à commencer par le Nokia 3310.

    Cet appareils fonctionnait sans faille, et a eu une excellente réputation.

    HMD Global, en fait ce qu'il reste de Nokia une fois la société et son nom rachetés par Microsoft a décidé de le relancer.

    Le produit n'est pas tout à fait le même, seules les grandes lignes sont reprises. On a toutefois toujours le même clavier mais aussi un écran plus grand, et Android qui tourne derrière.

    Il gardera quand même une autonomie en conversation de 22h et en veille près d'un mois avec une batterie amovible.
    Il sera vendu 49 euros.

  • Cartes SD: la norme UHS-III est annoncée (MacBidouille)

    La SDA a annoncé la nouvelle version de sa norme, l'UHS-III.
    Cette nouvelle norme double les débits de la précédente et peut atteindre un maximum théorique de 624 Mo/s.

    La SD association vante l'intérêt de ces débits pour les appareils capables d'enregistrer en 4K et en 8K.
    Les premiers appareils compatibles devraient arriver dans les prochains mois. Pour les cartes, ce sera certainement encore plus rapide, étant donné que Sony vient de présenter une carte qui sature la norme UHS-II avec des débits atteignant les 300 Mo/s.
  • Un autre ransomware découvert sur Mac (MacBidouille)

    Des chercheurs en sécurité ont annoncé avoir découvert un nouveau crypto-ransomware.
    Pour rappel, ce type de logiciel malveillant va s'installer et chiffrer la plupart des données sur la machine ciblée, y compris les disques réseau et sauvegardes éventuellement branchées sur la machine. Ensuite, il réclamera une rançon (en Bitcoins) pour fournir la clé de déchiffrement sans laquelle il est virtuellement impossible de récupérer ses données intactes.

    Ce nouveau ransomware se cache dans des fichiers torrent d'applications piratées.

    Une fois installé par l'utilisateur (il ne peut le faire seul), il va remplir son office et ajouter un fichier readme.txt à divers endroits.

    Ce fichier contient la demande de rançon et le mode d'emploi pour la payer sous une semaine, faute de quoi il ne sera plus possible de récupérer les données.

    Même s'il n'est pas parfait, le ransomware, codé en Swift, remplit son rôle.

    Il est donc plus important que jamais de se méfier de tout exécutable téléchargé si l'on n'est pas certain de celui qui vous l'a adressé.

    En attendant, il est probablement préférable d'avoir une sauvegarde, un clone, de son disque qui ne soit branché qu'épisodiquement. Il ne sera probablement pas à jour en cas de nécessité de récupération, mais vous permettra de récupérer une grosse partie des données perdues.

  • Qualcomm lance un nouveau modem 4G (MacBidouille)

    La semaine dernière nous vous parlions de l'arrivée chez Intel d'un modem 4G destiné aux appareils mobiles.
    Le XMM 7480 a refait le retard d'Intel sur ce que propose Qualcomm avec son Snapdragon X16, à savoir une bande passante maximale en téléchargement de 1 Gbit/s grâce à l'agrégation de quatre bandes de fréquences.

    Qualcomm a annoncé le Snapdragon X20, qui lui permet de reprendre l'avantage.

    Ce nouveau venu permet maintenant d'agréger 5 bandes de fréquences et d'atteindre les 1,2 Gbits/s si les équipements réseau le permettent (ce qui est loin d'être le cas en France).

    Qualcomm revient donc en tête, ce qui ne devrait toutefois pas empêcher Apple, selon toute probabilité, de n'utiliser dans l'avenir que des modems Intel, qui sont maintenant compatibles avec tous les opérateurs du monde.

  • Samsung Launches the 9.7-inch Galaxy Tab S3: Snapdragon 820 with 6000mAh and HDR (AnandTech)

    Along with the Galaxy Book parts being launched today, Samsung also announced the next generation of Galaxy Tab. The S3 is also an iterative design, with what Samsung believes is the premium Android tablet available in the market. Starting with the Snapdragon 820 SoC, featuring Qualcomm’s custom Kryo cores, the headline message for the S3 is support for HDR 10-bit content as well as a 6000 mAh battery and support for fast charging technology.

    Aside from the SoC, the tablet is set to be offered in a 4GB DRAM and 64GB storage option, with a microSD card allowing for another 256GB. Wireless, aside from the 2x2 802.11ac inside, comes via an LTE Cat.6 modem, good for 300 Mbps downlink speed. There is also support for BEIDOU and GALILEO location detection services.

    The 9.7-inch display uses Samsung’s Super AMOLED display technology, with a resolution of 2048x1536, and uses quad-stereo speakers tuned by AKG/Harman. Similar to the Galaxy Book, Samsung is promoting its latest ‘Flow’ technology, allowing biometric login for wirelessly tethered devices, and the new S Pen with ‘screen off’ note taking functionality. These are built upon Android 7.0, which along with the SoC is engineered for 4K60 video playback.

    The camera setup is similar to the 12-inch Galaxy Book, with a 13MP rear sensor with auto-focus and a 5MP front sensor (other details should emerge on these. Samsung is listing the weight at around a pound for the S3 (434g in LTE mode), and the unit comes with a kickstand.

    We’re awaiting more details on the hardware and the implementation, hopefully coming through the press event that’s starting as I’m writing this news post. We’ll hopefully get pricing and availability information too.

    Edit: All Tab S3 units will come with the S-Pen as standard, and Samsung are partnering with Staedtler to provide a special S Pen called Noris Digital in the traditional school pencil style.

  • Samsung Launch the Galaxy Book 10.6-inch and 12-inch: Windows Tablets with Kaby Lake (AnandTech)

    The announcements this year from Samsung are notably muted without the launch of a new Galaxy smartphone, but despite this being a mobile-focused conference in Barcelona this week, there were a few new Samsung devices to whet the appetite. The first is actually more of a PC, in a Windows-10 based tablet called the Galaxy Book, available in either 10.6-inch LCD or 12-inch Super AMOLED display, firing in the line of the Microsoft Surface range. Samsung is primarily aiming these new devices with a nod towards the professional market, but are keen to say that they’re suitable for consumers as well.

    At the heart of each tablet is a Kaby-Lake CPU based on Core m for the 10.6-inch or Core i5 on the 12-inch, supported in various configurations of DRAM and storage but both having an integrated LTE Cat 6 modem for wireless support. Aside from the Core i5, and offering an 8GB DRAM/256GB storage model, the key element of the 12-inch device is the Super AMOLED display running at 2160x1440 which Samsung states supports videos in HDR 10-bit. The 10.6-inch version will use a 1920x1280 TFT LCD display.

    The larger device will use a 13MP rear camera with autofocus, and both units have a 5MP front facing camera. Aside from microSD support, users will also get USB 3.1 Type-C ports. Both units will come with Windows 10, support for the next generation S Pen using a new 0.7mm tip and in ‘screen off’ mode which allows for note taking without the display being on.

    Battery for the units comes in at 30.4 Wh for the smaller one, and 39.04 Wh for the larger display. Samsung is quoting around 10 hours of use for both and both will have access to fast charging. It is worth noting that with the specifications, Samsung lists the 10.6-inch display as supporting 4K30 playback but the bigger unit, with a faster processor, can handle 4K60 playback. Both units have vents for fans, it must be noted.

    We’re awaiting more information about the modem support, pricing and availability. There might also be a chance for some hands-on time with the units, as it will be interesting to see how well that bezel measures up in normal use.

    Edit - it seems the Core i5 is a U-series product. That's 15W normal, or 7W/9.5W in cTDP down mode.

    Edit 2: The CAT 6 LTE modems are from Intel. Source: Brian Krzanich Twitter

    Edit 3: All Books will come with a keyboard and S-Pen as standard.

  • MWC 2017: Samsung Press Conference (AnandTech)

    We're here at Samsung's MWC 2017 press conference. The Galaxy S8 will be a no show, but Samsung has some other mobile devices to show off.

  • Intel Announces Xeon D-1500 Network Series SoCs with QuickAssist, Four 10 GbE Ports (AnandTech)

    Intel’s Xeon D SoCs and supporting platforms for storage, web hosting and networking applications seem to be getting traction with actual hardware manufacturers as well as end users. This month Intel announced expansion of the lineup of these processors with several new models supporting QuickAssist accelerator and increased amount of 10 GbE ports. The new Xeon D SoCs for networking applications simplify creation of various devices due to higher integration.

    The newest Intel Xeon D-1500-series products use Intel’s prowess in highly integrated SoCs, this time powered by up to 16 of the company’s high-performance Broadwell cores, featuring a dual-channel DDR3L/DDR4 memory controller as well as rich I/O capabilities (up to 24 PCIe 3.0 lanes, 6 SATA ports, two 10 GbE ports, USB, etc.). The Xeon D SoCs support the majority of RAS capabilities of the Xeon E5 v3 processors, including ECC, MCA, PCIe ECRC (end-to-end CRC), SMM and so on. At present, Intel offers two application-specific lineups of its Xeon D SoCs: for web hosting servers and for networking devices. The latter is going to receive several new models with improved feature-set in the coming months.

    Firstly, Intel plans to integrate its QuickAssist accelerator with up to 40 Gbps of compression/encryption throughput into the new Xeon D SoCs. Today, developers of network equipment have to use Intel’s discrete QuickAssist hardware to speed up compression/encryption operations, which means larger footprint, higher power consumption and additional costs. The integration of the accelerator will enable designers to reduce dimensions of their motherboards and will reduce power consumption a bit, assuming they can feed it. Since Intel does not announce prices of the new SoCs right now, it is hard to tell how the integration affects the cost of the platforms (Intel does not mention that in its documents), but usually the elimination of one component can lead to the elimination of some other parts too, so BOMs get lower.

    Secondly, Intel intends to integrate four 10 GbE controllers (at present, we do not know whether they can be grouped for 40 Gbps or split for 2.5 or 5 Gbps ports) into the new Xeon D SoCs, doubling the amount of 10 GbE ports supported by today’s Xeon D processors. Obviously, for applications that need over four 10 GbE ports, Intel’s FM10000 Ethernet PHYs will still be required, but for other devices having the integration will help to reduce extra chip count. Again, the integration here could mean a reduced footprint, lower chip count and power consumption.

    The new Intel Xeon D-1500 SoCs with enhanced networking capabilities are currently sampling with Intel’s customers. The chipmaker expects its clients to start launching their products based on the new processors by mid-2017. 

    (Ian: It's worth noting that Xeon D-1500, as a family, has been around for a few years now. No news yet on updates to Xeon-D using Skylake or Kaby Lake cores.)

    Related Reading:

  • Huawei Launches the P10 and P10 Plus, in Green (AnandTech)

    Today Huawei is unwrapping their latest mainstream device, evolving from the P8 and P9 into the P10. The yearly cadence regularly brings high-level design features from their Mate series into the P-series several months later, and so naturally the P10 gets the latest HiSilicon Kirin 960 SoC with an integrated Cat12/11 modem. As with the last versions, the P8 had the P8 Plus, the P9 had the P9 Plus, the P10 will also be paired with the P10 Plus, featuring near-same internals but with a larger screen and a few extra premium features.

    To address today’s headline, Huawei is working with Pantone for the material design of the new P-series devices. Under the heading of ‘style’ and matching ‘fashion’, through collaborating with Pantone Huawei is offering the P10 and P10 Plus in Dazzling Blue (similar but slightly different to the Honor 8 design) and ‘Greenery’. It makes for a very striking and green device. Apparently this is the color of the upcoming season, although as Huawei stated at our pre-briefing, much like previous colors they’ve used, they know that they get a polarized reaction to some of the more esoteric color implementations.

    Huawei P9 & P10
    Model P10 P10 Plus   P9 P9 Plus
    SoC HiSilicon Kirin 960
    4x Cortex A73
    4x Cortex A53
      HiSilicon Kirin 955
    4x Cortex A53 @ 1.8GHz
    4x Cortex A72 @ 2.5GHz
    Mali-T880MP4 @ 900MHz (?)
    4GB LPDDR4
    64 GB 64 GB
    128 GB
    Display 5.1"
    1080p LCD
    1080p IPS LCD
    5.5” 1080p AMOLED
    Modem LTE Cat 12 DL / Cat 11 UL   2G/3G/4G LTE Cat 6
    Camera 20MP Monochrome
    12MP RGB
    20MP Monochrome
    12MP RGB
      Dual Rear Camera
    12MP Monochrome
    12MP RGB
    1.25µm pixels
    F/2.2 aperture
    Front Facing Camera
      Front Facing Camera
    8MP ( 3264 × 2448 ) 
    Sony IMX179 1/3.2"
    w/ 1.4µm pixels
    F/2.4 aperture
    Battery 3200 mAh 3750 mAh   3000mAh 3400mAh
    OS Android 7.1
    with EMUI 5.1
      Android 6.0
    with EmotionUI 4.1
    Connectivity 802.11a/b/g/n/ac 
    2.4 & 5GHz
    BT 4.2, USB-C, GPS/GNSS,
    2.4 & 5GHz
    BT 4.2, USB-C,
    SIM Size NanoSIM +
    NanoSIM (w/o microSD)
      NanoSIM +
    NanoSIM (w/o microSD)
    MSRP 4GB/64GB 649€ 4GB/64GB 699€   3GB/32GB: 599€  
      8GB/128GB 799€   4GB/64GB 649€ 4GB/64GB 749€

    Aside from the color, the P10/P10P both use the Kirin 960 silicon, which we saw in the Mate 9/Mate 9 Pro. We’ve done a review of the Mate 9, and are putting some finishing touches to a Kirin 960 deep dive with some back and forth with HiSilicon on a few of the numbers. Under the hood Kirin 960 is the first mobile SoC to use ARM Cortex A73 cores, which the SoC combines four of in a big.Little with a set of ARM Cortex A53s. The Kirin 960 is also the first SoC to use ARM’s latest Mali ‘Bifrost’ architecture, under the G71 heading, and the 960 uses an MP8 configuration. This is all with TSMC’s 16FF+ node. Huawei also integrates its own modem, suitable for Cat 12 download and Cat 11 upload speeds. The P10 and P10P will mirror each other on the pure SoC, however the P10P will also support 4x4 MU-MIMO support on the DL link due to a couple of additional antenna in the larger device.

    The main obvious difference between the P10 and P10P will be the size of the device, the display, and the battery. The P10 uses a 5.1-inch 1920x1080 LCD, while the P10P rises up to 5.5-inch and a 2560x1440 and a slight curve to the display, similar to the Mate 9 Pro. Neither device uses OLED, so DayDream compatibility may not be a prominent feature here. Despite working with Pantone on the color of the chassis for these phones, I did ask about Pantone working on the color accuracy of the displays (a somewhat regular issue on Huawei devices), but there was no collaboration at that level. On the battery, the P10 has a 3200 mAh unit, while the P10P goes up to 3750mAh, and both support Huawei’s new SuperCharge technology that was bought in with the Mate 9.

    One of the big things to notice with the P10/P10P, compared to any other previous mainstream Huawei device, is that the fingerprint sensor has moved from the rear to the front. Huawei did this with the Mate 9 Pro on a small scale, but it is rolled out across the new P-series products. As a result we get an elongated button for multiple gestures, such as swiping for apps, short press for back, long press for home, and the previous on-screen buttons have disappeared. Personally I would find this change taking some time to get used to. On the Mate 9, the ‘active app’ button on the right also yielded the split screen mode during a long press, but that is now moved to a knuckle swipe function.

    On the cameras, the P10/P10P has some updates here. The rear cameras use the second generation of Leica technology, similar to the Mate 9, using a 20MP monochrome sensor and a 12MP RGB sensor, both supporting IOS up to 4K. One change is that the P10/P10P will support a monochrome ‘bokeh’ effect due to dual camera apertures, and similar to the RGB mode it will support adjusting the depth after the picture is taken. On the P10 the cameras support f/2.2, but this is upgraded on the P10P for f/1.8. On the software side for the rear cameras, Huawei has a ‘Portrait’ mode, which comes across like a beauty mode for smoother skin and brighter colors, but this is part of the Leica partnership rather than a few other ‘beauty mode’ variants we’ve seen in the past. Both devices use an 8MP front camera.

    For capacity variants, both models will offer 4GB DRAM with 64GB variants, however the P10P will also be available in a 6GB/256GB model as well for specific regions only.

    On colors, Huawei will offer both devices in ‘Greenery’, Dazzling Blue, Rose Gold, Prestige Gold, Ceramic White, Dazzling Gold, Graphite Black and Mystic Silver. Dazzling Blue will be slightly different, with the rear of the case being textured (via diamond cutting and tooling) to give it a mildly oliophobic structure to repel fingerprints and oils.

    One of the new software features will be Highlights, in collaboration with GoPro. This is similar to various apps that already collage images based on location / GPS data / time frame, however the Highlights gallery also implements GoPro software for users to combine images and video with music and transitions into a 30s or 90s video. We asked if the software does all the video transcoding, and works with different resolution video and transcodes that – the answer was yes, but we were unable to get information on the bitrate. Along with Highlights, the P10/P10P get EMUI 5.1, which implements a new ‘Ultra Memory’ feature which recycles memory when certain whitelisted apps are loaded. This is to remove any additional latency from clearing memory pages later in the apps use.

    Pricing sits at 649 Euro for the P10 at 4GB/64GB, 699 Euro for the P10 Plus in 4GB/64GB, and 799 Euro for the premium P10 Plus with 8GB/128GB. This latter SKU typically ends up only in select markets, unfortunately, but the other SKUs should be in Huawei's regular market chain.

  • NGD Launches Catalina: a 24 TB PCIe 3.0 x4 SSD with 3D TLC NAND (AnandTech)

    NGD Systems this week announced its first SSD that also happens to be one of the highest capacity drives in the industry. The NGD Catalina uses a proprietary controller as well as up to 24 TB of Micron’s 3D TLC NAND memory and apart from capacity, its key feature is a relatively low power consumption.

    Before we jump to the Catalina SSD, it makes sense to talk about NGD Systems (formerly known as NxGn Data) itself. The company was founded in June 2013 by a group of people who previously developed SSDs at companies like Western Digital, STEC and Memtech, with the corporate aim to develop drives for enterprise and hyperscale applications. Back in 2014, the company disclosed that its primary areas of interest were LDPC, advanced signal processing, software-defined media channel architecture and in-storage computation capability. NGD has been developing various proprietary technologies behind the Catalina since its inception and the SSD is a culmination of their work.

    The NGD Catalina is a large add-in-card with a PCIe 3.0 x4 interface that also supports a Mezzanine connector. Rather than have the NAND on the main card, instead the card uses multiple M.2 modules with Micron’s 3D TLC NAND. The 24 TB version of Catalina carries 12 of such modules, whereas lower capacity SKUs will use a fewer modules. According to NGD, the Catalina consumes only 0.65 W of power per Terabyte (which means ~15.6 W for the 24 TB SSD), but the card still has a 4-pin auxiliary power connector.

    Keeping in mind that the SSD has a PCIe 3.0 x4 interface, the peak read/write performance of the drive is limited to 3.9 GB/s. Meanwhile, NGD does not disclose official performance or endurance numbers for the Catalina SSD, but only says that the drive is optimized for read-intensive applications.

    The NGD Catalina is based on the company’s proprietary ASIC controller which performs LDPC ECC and enables NGD’s patented Elastic FTL (Flash Translation Layer) algorithm, which we believe is for software defined media channels and is claimed said to lower power consumption of SSDs. We do not know anything about the architecture of the controller used by the Catalina, but back in 2014 the company said (according to EETimes) that its controller used ARM's Cortex-A9 cores that ran a micro-OS based on Linux to perform the usual tasks as well as in-storage (In-Situ) computing.

    In-Situ is One of the technologies that NGD has been evangelizing since its establishment. In-storage processing moves a compute function closer to the data and allows executing an app on the drive through the Cortex A9s. This concept makes particular sense for various applications that have to search through and analyze large amounts of data (e.g., Big Data) because it eliminates in-device network bottlenecks (there is no need to transfer all the data to the CPU if basic search functions can be done on the drive). The In-Situ paradigm does not abolish host CPUs or operating systems that make requests and manage operations, but it reduces loads on data buses, network, and CPUs to improve performance and reduce power consumption of data centers. It is not stated if the NGD Catalina supports In-Situ though.

    The NGD Catalina is being qualified at various OEMs and is available at various capacity points to interested parties. The company does not talk about exact pricing of its drives because a lot depends on actual capacity points as well as volumes of the SSDs acquired.

    Related Reading:

  • MWC 2017: Huawei P10 and P10 Plus Press Event Live Blog (AnandTech)

    We're here at MWC waiting for Huawei's Press Event to start. We're expecting to see the P10 and P10 Plus, given that their names were on the front of the building when we entered. Starts at 2pm CET!

  • Announcing the LG G6: Snapdragon 821, 18:9 Display, IP68 Waterproof (AnandTech)

    Today in Barcelona, LG officially unveiled the G6, the next installment of the venerable G-series that's now classified as a lower-end flagship below LG’s V-series. Like the G5 before it, the G6 receives a significant makeover, with an all-new design, a bigger display, and updated hardware.

    In an effort to boost sales last year, LG modernized the G5’s design and construction and gave it a pair of features that set it apart from Korean rival Samsung’s Galaxy phones. It switched from a traditional plastic construction to a thin, all-aluminum chassis that was painted over to hide the antenna lines. The previous model’s rear-mounted volume controls were relocated too.

    The G5’s most innovative feature was its detachable chin module that granted access to the battery and allowed for quick battery swaps, a unique ability for a metal phone. This base module could also be replaced with additional accessories, making the G5 one of the few attempts at a modular smartphone. Unfortunately, the initial modules, the LG CAM Plus and LG Hi-Fi Plus, were uninspiring, and more compelling options failed to materialize. Swapping modules was also clunky because it required removing the battery and rebooting the phone, an issue not shared with Motorola’s superior Moto Mod solution that was introduced alongside its new Moto Z family.

    The G5’s modular gamble failed to pay off, and its other features were not enough to justify its higher price, leading to poor sales that fell well below LG’s expectations. Increasing competition from Chinese OEMs is also placing additional pressure on LG, which can ill afford another misstep. It's not too surprising then to see LG take a more conservative approach with the G6, focusing on correcting the previous model’s shortcomings rather than adding radical new features to make it stand out.

    LG G Series
      LG G6 LG G5
    SoC Qualcomm Snapdragon 821
    (MSM8996 Pro)

    2x Kryo @ 2.34GHz
    2x Kryo @ 2.19GHz
    Adreno 530 @ 653MHz
    Qualcomm Snapdragon 820

    2x Kryo @ 2.15GHz
    2x Kryo @ 1.59GHz
    Adreno 530 @ 624MHz
    Display 5.7-inch 2880x1440 (18:9) IPS LCD 5.3-inch 2560x1440 IPS LCD
    Dimensions 148.9 x 71.9 x 7.9 mm
    163 grams
    149.4 x 73.9 x 7.7 mm
    159 grams
    RAM 4GB LPDDR4 4GB LPDDR4-3188
    NAND 32GB / 64GB1 (UFS 2.0)
    + microSD
    32GB (UFS 2.0)
    + microSD
    Battery 3300 mAh (12.54 Wh)
    2800 mAh (10.78 Wh)
    Front Camera 5MP, f/2.2, wide-angle (100°), auto HDR, screen flash 8MP, 1/4" Toshiba T4KA3, 1.12µm pixels, f/2.0, HDR, screen flash
    Rear Camera Primary: 13MP, Sony IMX258 Exmor RS, 1.12µm pixels, f/1.8, PDAF, wide-angle (71°), OIS, auto HDR, dual-tone LED flash Primary: 16MP, 1/2.6" Sony IMX234 Exmor RS, 1.12µm pixels, f/1.8, Laser AF, 3-axis OIS, HDR, color spectrum sensor, LED flash
    Wide Angle: 13MP, Sony IMX258 Exmor RS, 1.12µm pixels, f/2.4, PDAF, wide-angle (125°), auto HDR, dual-tone LED flash Wide Angle: 8MP, Sony IMX268 Exmor RS, 1.12µm pixels (assumed), f/2.4, wide-angle (135°), Laser AF, OIS, HDR, color spectrum sensor, LED flash
    Modem Qualcomm X12 (Integrated)
    2G / 3G / 4G LTE (Category 12/13)
    Qualcomm X12 (Integrated)
    2G / 3G / 4G LTE (Category 12/13)
    SIM Size NanoSIM NanoSIM
    Wireless   802.11a/b/g/n/ac 2x2 MIMO, BT 4.2, NFC, IrLED, GPS/GNSS
    Connectivity USB 2.0 Type-C, 3.5mm headset USB 2.0 Type-C, 3.5mm headset
    Additional Features QC 3.0 fast charging, wireless charging (WPC & PMA)2, IP68 environment protection, Hi-Fi Quad DAC3  QC 3.0 fast charging, modular design
    Launch OS Android 7.1 with LG UX 6.0 Android 6.0.1 with LG UX 5.0

    1 - Only in select markets Korea, Hong Kong, Asia, India, CIS
    2 - Only for US
    3 - Not available in US, EU, South America, MEA

    The G6’s larger 3300 mAh battery should help alleviate one of our complaints about the G5: poor battery life. It’s still a bit smaller than the batteries in the Pixel XL (3450 mAh) and Galaxy S7 edge (3600 mAh), both of which have slightly smaller 5.5-inch AMOLED displays, but the G6 should last noticeably longer than the G5. With the Galaxy Note7 recall still fresh in people’s minds, LG made the point that the separator between the anode and cathode in the G6’s battery is 15.5µm thick versus 8.5µm for the Note7.

    The G6 also gets a complete redesign. LG has abandoned the G5’s modularity, simplifying the phone’s construction. This means that the G6’s battery is sealed inside and no longer removable too. The chassis is still aluminum, with internal bracing to increase rigidity, but there’s a piece of glass covering the plastic back with a brushed aluminum finish below. Its edges are slightly beveled where they meet the metal’s polished chamfer, improving in-hand feel.

    The dual rear camera module, which looks like a pair of eyes staring you, now sits flush with the back, just above the fingerprint sensor that also works as a power button. The G6 still comes with a 3.5mm headphone jack on the top edge, and the single, downward-firing speaker sits to one side of the USB Type-C port on the bottom.

    The interesting change is around front, however. Overall display size increases to 5.7-inches, but it only gets taller and not wider, resulting in an 18:9 aspect ratio (instead of the more common 16:9) that increases screen area while keeping the phone narrow enough to easily hold in one hand. LG has modified its built-in apps to take advantage of the extra screen height, including the camera, which has room to show a strip of image thumbnails next to the camera controls. The corners of the IPS LCD are also rounded instead of sharp angles, which improves screen durability by reducing stress concentrations, according to LG’s testing, and matches the rounded corners of the frame and the rounded graphical elements in LG UX 6.0.

    Companies continue to chisel away at the bezels surrounding the display. While the G6 falls a little short of Xiaomi’s nearly all-screen Mi MIX, it still achieves a screen-to-body ratio over 80%. With the smaller bezels, the G6 is actually shorter and narrower than the G5 and a little shorter than the Galaxy S7 edge even though it has a smaller 5.5-inch display.

    Unlike the outside, the hardware inside the G6 remains relatively the same. The Snapdragon 820 SoC gets replaced by the Snapdragon 821, which bumps peak frequencies to 2.19GHz and 2.34GHz for the two lower-power and two higher-performance Kryo CPU cores, respectively. The Adreno 530 GPU also gets a higher operating point. The real-world difference between the Snapdragon 820 and 821 is small, however. An internal heat pipe covers the SoC and redistributes heat along the phone’s left edge, which should help reduce thermal throttling.

    After announcing the Snapdragon 835 last fall and releasing more details at CES, most people assumed the G6 would receive Qualcomm’s latest SoC. Initial supply seems to be limited, though, for the first product to use Samsung's new 10nm process, putting LG and other OEMs launching flagship phones in Q1 2017 in a difficult position: either delay their products or move forward with last year's Snapdragon. Going with the 821 does give LG a time-to-market advantage over Samsung's Galaxy S8, which is launching later than usual.

    LG is sticking with 4GB of LPDDR4 RAM for the G6 while other flagships are moving to 6GB or more, although it should still be enough for heavy multitasking. Internal storage is stuck at 32GB, although select Eastern markets will see a 64GB option available. Additional storage can be added with a microSD card.

    Last year LG gave the G5 a dual rear camera. Unlike systems from Huawei, which combine the output of RGB and black and white sensors to improve image quality, the G5’s cameras worked independently, providing a pseudo-zoom feature that switched between a short focal length lens and an even shorter wide-angle lens.

    The G6 uses a similar dual rear camera setup, except both use the same 13MP Sony IMX258 sensors. This should improve quality for the wide-angle camera that used an 8MP sensor before, fully half the resolution as the G5’s main camera. The balanced sensors and Qualcomm’s Optical Zoom feature provided by the Snapdragon SoC eliminate the stutter or pause that would occur when switching between the two cameras. This transition is now perfectly smooth on the G6 other than a slight shift in perspective caused by the different focal lengths.

    The primary rear camera has OIS (not wide-angle camera), but the G5’s hybrid autofocus system, which combined contrast AF, laser AF, and phase detect AF (PDAF), is gone. The G6 still supports contrast and PDAF, but this is definitely a step backwards when even mid-range devices are adopting hybrid autofocus systems that combine three or four different AF methods. The separate color spectrum sensor, which helped set white balance, is also gone. These omissions seem like a cost-cutting move to make room for some new features.

    One new trick for the G6 is wireless charging. It supports both the WPC and PMA standards, but this feature is only available in the US. LG says its market research revealed that wireless charging is a lower priority in other countries, and it did not want to increase cost by including features people would not use. The G6 still includes Qualcomm’s Quick Charge 3.0 fast-charging technology, though.

    The G6 also adds IP68 dust and water resistance. This rating means it’s completely sealed against dust and can remain immersed in 1.5m of water for up to 30 minutes. Select markets will also get LG’s Hi-Fi Quad DAC setup for improved audio quality when using headphones. Unfortunately, customers in the US, EU, South America, and MEA countries will not get the Quad DAC and will have to make do with sound more typical of a smartphone.

    The G6 comes in three different colors—black, silver, and white—and will be available for sale in South Korea within days. LG has not disclosed pricing or availability in other countries yet.

  • MWC 2017: LG Press Event Live Blog (6am ET) (AnandTech)

    We're here in Barcelona for Mobile World Congress. One of the first big press events is LG, who should be announcing the G6.

  • Seiko relance la production d'une montre portée par Steve Jobs (MacBidouille)

    Les plus anciens se souviennent certainement de cette photo.

    Elle faisait partie d'une série d'images prises de Steve Jobs lors du lancement du Macintosh.

    A l'époque il ne portait bien entendu pas d'Apple Watch, mais une Seiko.

    L'an dernier cette montre avait été adjugée aux enchères plus de 40 000$.

    Seiko a décidé de surfer sur cette vague et de relancer, au Japon pour le moment, la commercialisation de ce produit vintage.

    Il est ironique et amusant de savoir que les vrais fans de cet homme porteront peut-être cette ancienne montre à quartz plutôt qu'une Apple Watch.

  • Mises à jour et téléchargements de la semaine (Génération NT: logiciels)
    Comme tous les dimanches, retrouvez notre résumé des mises à jour et téléchargements de la semaine.
  • XFX Starts to Sell Single-Slot Mini-ITX Radeon RX 460 Slim Graphics Cards (AnandTech)

    XFX has quietly started to sell its slim Radeon RX 460 video cards, which use a single-slot cooling system and can fit into a Mini-ITX computer. The cards features 2 or 4 GB of memory depend on SKU, as well as three display connectors, making them suitable for SFF and HTPC builds. Pricing of the cards is in line with AMD’s recommendations at around $140.

    The XFX Radeon RX 460 Slim Single Slot Design lineup consists of two graphics adapters carrying 2 or 4 GB of GDDR5 memory (operating at up 7 GT/s). The card ships with a 1220 MHz GPU boost clock - so XFX hasn't needed to make any sacrifices when it comes to top clockspeeds - and like every other RX 460 on the market we're looking at a cut-down version of the afformentioned Polaris 11 GPU (896 stream processors). The GPU is cooled by a relatively large cooling system featuring an aluminum heatsink with an 80- or a 90-mm fan at its center. When it comes to connectivity, the cards have one DL-DVI-D port, one DisplayPort 1.4, and one HDMI 2.0b port.

    The AMD Polaris 11 GPU supports a contemporary feature-set via the DirectX 12 and Vulkan APIs. What's more, the graphics chip features hardware-accelerated decoding and encoding of HEVC (H.265) and VP9 video at 4Kp60, as well as HDR10 video output and HDCP 2.2 — all important capabilities for HTPCs. Last, but not least, performance of the GPU in graphics applications is considerably higher compared to most of today’s iGPUs and thus the new boards can be used to upgrade various OEM PCs.

    The key selling points of the XFX Radeon RX 460 Slim Single Slot Design graphics cards are their short length and uncommon single-slot width. The cards are just 170 mm long and thus are fully compatible with Mini-ITX builds. In addition, they can fit into densely packed systems that do not have a lot of spare space inside for a more traditional double-wide card. Furthermore the cards as sub-75W, and consequently do not require any auxiliary power connectors, which means they can be used to upgrade PCs whose PSUs don't offer those connectors.

    XFX Radeon RX 460 Slim Single Slot Design Graphics Cards
      RX-460P4TFG5 RX-460P2TFG5
    GPU AMD Polaris 11
    Stream Processors 896
    Texture Units 56
    ROPs 16
    Core Clock (MHz) 1090
    Boost Clock (MHz) 1220
    Memory Capacity 4 GB 2 GB
    Type GDDR5
    Clock 7 Gbps
    Bus Width 128 bit
    Outputs DisplayPort 1 × DisplayPort 1.4
    DVI 1 × DVI-D
    HDMI 1 × HDMI 2.0b
    TFLOPS (FP32) Up to 1.95
    TDP 75 W
    Launch Date 2/2017 unknown
    Additional Information Link Link

    The XFX Radeon RX 460 Slim Single Slot Design graphics cards with 4 GB of GDDR4 memory are already available from Amazon and Newegg for $167.99 and $139.99 (this is AMD’s MSRP for the RX 460 4 GB), respectively. The 2 GB version of the card is missing from retail, but it should hit the market eventually.

    One of the images in the gallery courtesy of Newegg.

    Related Reading:

  • Apple échange les écrans des Retina qui perdent leur traitement antireflet (MacBidouille)

    En mars dernier nous vous avions signalé un problème touchant des MacBook Pro Retina dont le traitement antireflet de l'écran partait.

    Merci à Grégory de nous apprendre que la société vient de mettre en place un programme de garantie étendue pour ce problème.
    Ce programme permet pendant les trois ans suivant la date d'achat ou jusqu'au 16 octobre 2016, la date la plus éloignée étant prise en compte, de faire échanger son écran sans avoir à payer.

    Il faut pour cela passer par le SAV d'un Apple Store ou un CSAA. Bien entendu si vous avez déjà payé pour une telle réparation, Apple vous remboursera.

    [MàJ] Macrumors nous apprend qu'Apple a étendu ce programme d'échange. Il sera valable jusqu'à 16 octobre 2017 (soit un an de plus que prévu) ou à l'anniversaire des trois ans de la machine.

  • Sony annonce les cartes SD les plus rapides du moment. (MacBidouille)

    Sony a dévoilé sa nouvelle gamme SF-G de cartes SD.

    Ce sont les plus rapides jamais proposées avec un débit en lecture de 300 Mo/s et en écriture, 299 Mo/s.

    On ignore le prix auquel ces produits seront vendus, mais il sera certainement très salé.

  • iPhone: avoir fait remplacer par un tiers son écran n'annule plus la garantie (MacBidouille)

    Jusqu'à maintenant Apple avait une politique très simple et claire en terme de garantie d'iPhone. Si la société y trouvait une pièce détachée venant du marché parallèle, écran, batterie ou encore autre petit composant annexe, elle considérait que le produit n'avait plus droit au moindre service sous garantie, même dans le cas d'une garantie étendue.

    Macrumors rapporte que la société a publié un mémo interne à destination de ses SAV qui assouplit cette politique.
    Dorénavant, et pour résumer les choses, la société acceptera une prise en charge sous garantie tant que les composants incriminés ne seront pas causes des problèmes ou s'ils n'en poseront pas lors du démontage.
    Les SAV seront aussi invités à proposer au client un devis pour remettre à la place des pièces détachées "non conformes" des pièces d'origine.

    Le refus de prise en charge était de toute façon à la limite de la légalité car Apple aurait dû dans ce cas prouver que le composant était la cause des nouveaux problèmes.

  • Un iPhone 7 Plus en feu (MacBidouille)

    Depuis 2 jours la vidéo partagée sur Twitter et montrant un iPhone 7 Plus prenant feu suscite beaucoup d'attention. C'est rare, mais ça peut arriver et le cas présenté ci-dessous est d'autant plus crédible qu'il a été filmé. Apple a rapidement déclaré qu'il enquêtait mais ils n'ont pas encore communiqué de conclusion.

    Il y a la plupart du temps une raison au départ de feu : l'usage d'un chargeur de mauvaise qualité, une chaleur trop élevée ou une défaillance dans la batterie lithium-ion. Pour éviter ce dernier cas, il existe un certain nombre de protections intégrées à la batterie (en savoir plus sur ce PDF).

    La taux de défaillance selon plusieurs sources est estimé à 1 sur 10 millions. A moins que le cas se répète rapidement comme ce fut le cas avec le Samsung Note 7, ce phénomène reste exceptionnel et il n'y a pas de quoi s'alarmer.

  • Sony Announces SF-G UHS-II SD Cards: Up to Nearly 300 MB/s Read/Write Performance (AnandTech)

    Sony has announced its new lineup of SD cards for advanced 4K/8K, DSLR, and mirrorless cameras. The new SF-G-series memory cards use the UHS-II bus and one of Sony’s proprietary technologies to offer the company's highest read/write performance to date — up to nearly 300 MB/s. The cards will hit the market in the coming months.

    The Sony SF-G-series memory cards will be available in 32 GB (SDHC), 64 GB (SDXC), and 128 GB (SDXC) configurations. The key selling point of the new Sony SF-G cards is their performance: up to 300 MB/s read speed and up to 299 MB/s write speed, which a quick look finds is around 15% faster compared to competing products (such as the SanDisk Extreme PRO SD UHS-II or the Lexar Professional 2000x UHS-II, both of which offer up to 260 MB/s writes). The new cards from Sony are compatible with various types of SD-supporting devices (cameras, card readers, etc.), but to take full advantage of their speed one needs a device that fully supports the UHS-II bus and has the extra pins the wider bus requires.

    Sony is not reveaing how they're getting up to 299 MB/s sequential write performance in an SD card, instead only saying that it is enabled by its firmware. One possibility is that the cards use NAND flash memory with very large block sizes (supported by the SD 5.0 standard), which helps to boost write performance. In addition, the NAND controller inside the card may have a special pSLC cache with very fast writes and rather low usable capacities of the devices imply on that, but this could be verified only by testing one of these products.

    Sony UHS-II SD Cards at Glance
      32 GB
    64 GB
    128 GB
    Usable Capacity 28.8 GB 57.6 GB 115.2 GB
    Read Speed up to 300 MB/s
    Write Speed up to 299 MB/s
    Minimum Sequential Write Speed 30 MB/s
    Interface UHS-II
    Availability Spring 2017
    SDA Labels UHS-II, Class 10, U3

    The new cards from Sony carry the Class 10 and U3 labels to show that their performance does not drop below 10 and 30 MB/s when used with those standards' respective workloads. Being positioned for professional use, the Sony SF-G cards are also waterproof, static-proof, temperature-proof, and shock-proof, which is beneficial for people who travel a lot and/or have to use memory cards in tough conditions. In case the data on cards is lost, Sony supplies its File Rescue tool with them.

    Sony’s SF-G-series SDXC cards will be available this spring. Pricing is to be determined, but it will vary depending on capacities. In addition to the flash memory cards, Sony will also offer its clients a UHS-II-capable MRW-S1 card reader with USB 3.0 interface, whose price is also unknown.

    Related Reading:

  • Chine: le marché des smartphones toujours en forte croissance avec un Apple déclinant (MacBidouille)

    Canalys a publié ses chiffres pour les ventes de smartphones en Chine lors du quatrième trimestre 2016 et fait un bilan de l'année.
    Ce marché reste en forte croissance avec un volume de vente de 131,6 millions d'unités pour le quatrième trimestre 2016 et un volume annuel de 476,5 millions d'unités, soit une hausse par rapport à 2015 de 11,4%.

    Dans ce contexte haussier, Apple recule à la cinquième place des fabricants en ayant écoulé 43,8 millions d'iPhones. Xiaomi lui a pris la quatrième place malgré le fait que ce fabricant ait aussi subi une forte contraction de ses ventes.

    Il faudra réellement qu'Apple creuse un fossé avec ses concurrents lors de la sortie de son prochain iPhone si elle veut espérer regagner là-bas des parts de marché.

  • Post-infection : une évaluation de l'aide de produits de sécurité (Génération NT: logiciels)
    Nettoyage et récupération. Une évaluation de 15 suites et outils spécialisés de sécurité qui peuvent aider en cas d'infection par un malware.
Grace à ses technologies pointues, nous pouvons dire que notre système
ne plantera jamais. Il est parfaitement stable et ne craint plus non
plus les virus informatiques.
-- Jayce - Mes chaussures me serrent un peu --