• Crucial Announces DDR4-2666 DIMMs for Upcoming Server Platforms (AnandTech)

    Crucial this week introduced an expansion of its server-grade modules lineup with DDR4-2666 offerings. The new DIMMs will be compatible with some of the current as well as upcoming server platforms featuring Intel Xeon and other processors.

    Announced by Crucial this week are the new DDR4 LRDIMMs, RDIMMs, VLP RDIMMs, ECC SODIMMs and ECC UDIMMs rated to operate at 2666 MT/s interface speed with CL19 19-19-38 timings and at 1.2 V. The modules are available in 4 GB, 8 GB and 16 GB configurations and are aimed at less memory-dense server configurations. All the new DIMMs are powered by Micron’s 8 Gb DDR4 ICs made using 20 nm process technology, just like their DDR4-2133/2400 predecessors.

    Specifications of Crucial's Server DDR4-2666 Memory Modules
      Module Capacity Latencies Voltage Height
    ECC SO-DIMM 4 GB, 8 GB, 16 GB CL19-19-19-38 1.2 V 30 mm
    ECC UDIMM 31.25 mm
    VLP RDIMM 19 mm

    Increasing DDR4 interface speed from 2400 MT/s to 2666 MT/s amplifies theoretical peak bandwidth by 11% to 42.6 GB/s for a dual-channel memory sub-system, to 85.3 GB/s for of a quad-channel memory sub-system as well as to 127.9 GB/s for a six-channel memory sub-system. In any case, an 11% performance increase in bandwidth-hungry workloads without any rise of power consumption is a tangible benefit for many servers. On the other hand, it is noteworthy that to increase interface speeds to 2666 Mbps, the module maker also had to adhere to JEDEC specifications rise its CAS latency from CL15/CL16 and CL17 (DDR4-2133 and DDR4-2400) to CL19, which diminishes the latency performance benefits of higher clocks.

    Suppliers of server-class memory announce their products well ahead of their high-volume availability because CPU developers and makers of actual servers have to validate DIMMs before they use them in commercial machines. The situation is a bit different today. Officially, Intel’s current-generation Xeon E5 processors featuring the Broadwell-EP cores are compatible only with DDR4-2400 or slower DIMMs. However some OEMs offer Broadwell-EP machines that can officially support DDR4-2666 for lower memory density servers. Meanwhile, Intel and other manufacturers plan to introduce next-generation server platforms (such as Purley/Skylake-EP) that officially support new DDR4 configurations in 2017 and before those machines hit the market, new DIMMs need to pass a variety of validation process.

    The new server-grade DDR4-2666 memory modules from Crucial are available for purchase now. Their exact prices depend on volumes and negotiations between Crucial and its customers.

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  • Western Digital Ships 12 TB WD Gold HDD: 8 Platters and Helium (AnandTech)

    Western Digital has begun to ship its WD Gold HDD with 12 TB capacity to partners and large retailers. The 3.5” drive relies on the same platform as the HGST Ultrastar He12 launched this year, and will initially be available to select customers of the company. The WD Gold 12 TB is designed for enterprise workloads and has all the performance and reliability enhancements that we come to expect, but the availability at retail should make them accessible to wider audiences.  

    From a hardware point of view, the WD Gold 12 TB is similar to the HGST Ultrastar He12 12 TB hard drive: both are based on the fourth-generation HelioSeal technology that uses eight perpendicular magnetic recording platters with a 1.5 TB capacity for each platter. The internal architecture of both HDDs was redesigned compared to predecessors to accommodate the eighth platter. Since the WD Gold and the Ultrastar He12 are aimed at nearline enterprise environments, they are equipped with various sensors and technologies to protect themselves against vibration and as a result, guarantee sustained performance. For example, the WD Gold and the Ultrastar He12 attach their spindles both to the top and the bottom of the drives. In addition the HDDs feature a special technology that increases the accuracy of head positioning in high-vibration environments to improve performance, integrity, and reliability. Finally, both product families support TLER (time-limited error recovery) rebuild assist mode to speed up RAID recovery time.

    Since the WD Gold 12 TB and the HGST Ultrastar He12 are similar internally and feature the same 7200 RPM spindle speed, they also have similar performance — the manufacturer puts them both at 255 MB/s sustained transfer rate and 4.16 ms average latency. The main difference between the WD Gold and the HGST Ultrastar He12 are the enterprise options for the latter: there are models with the SAS 12 Gb/s interface and there are models with SED support and Instant Secure Erase feature.

    Comparison of Western Digital's WD Gold HDDs
    Capacity 12 TB 10 TB 8 TB 6 TB 4 TB
    RPM 7200 RPM
    Interface SATA 6 Gbps
    DRAM Cache   256 MB 128 MB
    NAND Cache   Unknown No Yes Unknown
    Helium-Filling   Yes No
    Data Transfer Rate (host to/from drive) 255 MB/s 249 MB/s 205 MB/s 226 MB/s 201 MB/s
    MTBF 2.5 million
    Rated Annual Workload 550 TB
    Acoustics (Seek)   - 36 dBA
    Power Consumption Sequential read 7 W 7.1 W 7.2 W 9.3 W 9 W
    Sequential write 6.8 W 6.7 W 7 W 8.9 W 8.7 W
    Random read/write 6.9 W 6.8 W 7.4 W 9.1 W 8.8 W
    Idle 5 W 5.1 W 7.1 W 7 W
    Warranty 5 Years
    Price as of September 9, 2017 MSRP $521.99 $410.99 $327.99 $244.99 $183.99
    Per GB $0.0435 $0.0411 $0.041 $0.0408 $0.046
    GB per $ 22.98 GB 24.33 GB 24.39 GB 24.48 GB 21.73 GB

    Western Digital aims its WD Gold and HGST Ultrastar He-series drives at operators of cloud and exascale data centers that demand maximum capacity. The 12 TB HDDs can increase the total storage capacity for a single rack from 2440 TB to 2880 TB, replacing 10 TB drives with 12 TB drives, which can be a major benefit for companies that need to maximize their storage capacity per watt and per square meter. Where the HGST-branded drives are made available primarily through B2B channels, the WD Gold are sold both through B2B and B2C channels and thus can be purchased by wider audiences. For example, boutique PC makers, as well as DIY enthusiasts, may start using the WD Gold 12 TB for their high-end builds, something they could not do with the HGST drives. These HDDs may be considered as an overkill for desktops, but since WD’s desktop offerings top at 6 TB, the WD Gold (and the perhaps inevitable future WD Red Pro 12 TB) is the WD’s closest rival for Seagate’s BarraCuda Pro drives.

    The WD Gold HDD is currently available directly from Western Digital for $521.99 as well as from multiple retailers, including Newegg for $539.99. While over $500 for a hard drive is expensive, it is actually less than Western Digital charged for its WD Gold 8 TB about 1.5 years ago ($595) and considerably less than the initial price of the WD Gold 10 TB drive last April.

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  • Lian Li Launches PC-T70 Test Bench (AnandTech)

    Lian Li has been one of the few large case manufacturers to consistently offer test benches over the years, and they have now launched their newest model, the PC-T70. First unveiled at CES 2017, this new test bench was developed with feedback from PC hardware reviewers and it has been designed with an eye towards easy access and simple hardware swapping. There is also an optional accessory kit that encloses the test bench with an acrylic cover, which simulates a closed-air environment and allows for testing conditions that more closely match a regular closed case. For those who would rather have the whole kit from the start, Lian Li will also be offering the PC-T70FX, which comes with the acrylic cover and side panels included.

    Starting off with the fundamentals, the PC-T70 is manufactured from both aluminium and steel and it is available in both black and white. It can handle motherboards ranging from Micro-ATX to E-ATX, and it has eight expansion slots that support cards up to 330mm in length, though longer cards should be fine as well if you don't install the acrylic cover. There is one small and six large pass-through ports that are used to cleanly route cables to the lower half. The bottom chamber can handle one ATX power supply up to 330mm in length, and it is also where you can install your choice of either five 2.5” and one 3.5” storage drives or one 2.5” and two 3.5” storage drives. There is also mounting space for some liquid cooling hardware, namely an up to 360mm radiator, a reservoir, and a pump. The front of the test bench features a small I/O area consisting of a 3.5mm audio input, a 3.5mm audio output, two USB 3.0 ports, and both power and reset buttons.

    If you have more advanced cooling needs, or if you're a reviewer that wants to be able to simulate a closed-air case environment, the T70-1 option kit is an accessory ​that is going to be of great interest:

    As mentioned above, the optional T70-1 upgrade kit encloses the test bench with an acrylic cover and side panels that serve as radiator mounts. The idea is that by enclosing the motherboard and other heat-generating components, reviewers will be able to simulate closed-air case environments that are more representative of the insides of regular PC cases. This should ensure more accurate testing of both thermals and acoustics. It should be mentioned that with the cover installed, CPU cooler height is reduced from an effectively unlimited height down to 180mm. Magnetic strips help secure the cover and keep it closed during transport.

    Also helping to secure the cover are the panels that enclose the side and back of the test bench. The aluminium side panels feature large cutouts with removable dust filters, and that is because each side panel can hold two 120-140mm fans or a single 240-280mm radiator. The rear panel has mounting holes for one additional 120mm or 140mm fan.

    The PC-T70FX model, which includes the T70-1 option kit, is available right now at Newegg.com for $180 USD. It is unclear if the solo PC-T70 will be available for sale in the future, though we suspect that it will because it has its own product page on Lian Li's website.

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  • IBM a distribué des clés USB avec un virus dessus (MacBidouille)

    IBM a lancé une alerte dans laquelle on apprend que des clés USB fournies par la société pour initialiser des serveurs contenaient un logiciel malveillant.

    Ces clés étaient fournies avec les produits suivants:

    IBM Storwize V3500 - 2071 modèles 02A et 10A
    IBM Storwize V3700 - 2072 modèles 12C, 24C et 2DC
    IBM Storwize V5000 - 2077 modèles 12C et 24C
    Modèles IBM Storwize V5000 - 2078 12C et 24C

    Le logiciel malveillant se copiait automatiquement sur le disque cible, mais n'était pas exécuté. Il fallait le lancer pour qu'il agisse.

    IBM conseille quand même d'initialiser ces clés ou de s'en débarrasser.

    On ignore où ces clés ont pu être infectées en masse, probablement sur leur site de production.

  • G.Skill Announces Trident Z RGB DDR4 Kits with 16 GB Modules, Up to 128 GB (AnandTech)

    G.Skill has recently launched new Trident Z RGB memory kits, this time aimed at Intel X99 platforms, and following the RGB trend they give owners of high-end desktops an opportunity to customize the look of DRAM inside their machines. This is also the launch where the company introduces its first 16 GB memory modules with programmable LED lighting.

    The Trident Z RGB memory modules feature programmable LED lightbars and can change their colors in accordance with user’s demands (G.Skill offers special software to customize lighting effects), providing the ability to modify the look of a PC on the fly. G.Skill first announced its Trident Z RGB memory modules in late 2016 and started to sell them early in 2017. Initially, G.Skill’s Trident Z RGB dual-channel kits were only focused on Intel’s Z270-based platforms and contained 8 GB DIMMs running at up to DDR4-3866 MT/s. Going forward, G.Skill will offer 16 GB Trident Z RGB modules in both dual-channel and quad-channel kits.

    Just like the Trident Z RGB 8 GB modules, the Trident Z RGB 16 GB DIMMs are based on Samsung’s 8 Gb B-die memory chips made using 20 nm process technology. The 16 GB modules will run at DDR4-2400 to DDR4-3866 with CL14-18 latencies at 1.2 V or 1.35 V, depending on the kit performance. The Trident Z RGB fully support Intel’s XMP 2.0 as well.

    G.Skill’s fastest dual-channel Trident Z RGB 32 GB (2×16 GB) kit will run at 3866 MT/s with CL18 18-18-38 timings. RGB commands a premium, so while the company’s fastest DDR4 kits (rated for DDR4-4266) are not RGB, the new modules are still a very high data rate for 16 GB modules. As for the fastest quad-channel kits, G.Skill now offers the Trident Z RGB 64 GB (4×16 GB) rated to operate at 3600 MT/s with CL17 19-19-39 latency settings as well as the Trident Z RGB 128 GB (8×16 GB) DDR4-3333 kit with CL16 18-18-38 timings.

    G.Skill's New Trident Z RGB Memory for Intel's X99 and Z270 Platforms
    Speed CL Timing Voltage Kit Configuration Kit Capacity
    DDR4-2400 CL15 15-15-35 1.2 V 2×16 GB
    4×16 GB
    8×16 GB
    8×8 GB
    32 GB
    64 GB
    128 GB
    64 GB
    DDR4-3000 CL14 14-14-34 1.35 V*
    DDR4-3200 CL14 14-14-34
    CL15 15-15-35
    DDR4-3333 CL16 18-18-38 8×16 GB
    8×8 GB
    128 GB
    64 GB
    DDR4-3466 CL16 18-18-38 2×16 GB
    4×16 GB
    8×8 GB
    32 GB
    64 GB
    64 GB
    DDR4-3600 CL17 19-19-39 2×16 GB
    4×16 GB
    32 GB
    64 GB
    DDR4-3866 CL18 18-18-38 2×16 GB 32 GB

    *1.35V is the standard high-performance voltage setting for DDR4

    While these kits are aimed at Intel systems, we would assume that qualification on Ryzen systems will be an ongoing process. G.Skill has just sent us a 2x8GB DDR4-3200 C14 kit of G.Skill FlareX (non-RGB) modules for our Ryzen testing, so it's clear that G.Skill (and others) will have AMD qualified kits in their roadmaps. Motherboard manufacturers typically have memory qualified validation lists on their websites for each motherboard, showing which modules have been confirmed to work. Initially it was hit and miss on DRAM qualification with the launch of Ryzen 7 due to timing, but most vendors are falling into place with appropriate BIOS updates.

    G.Skill traditionally does not announce MSRPs for its memory modules, due to the volatility of the DRAM ICs, but given the fact that DRAM pricing is generally increasing, expect the new Trident Z RGB kits to be priced at high levels. Moreover, since it is not easy to handpick 8 Gb chips for high-speed 16 GB DDR4 memory modules, expect the manufacturer to charge a premium for kits that use high-capacity DIMMs. As an example, right now G.Skill offers 32 GB (4×8 GB) DDR4-3600 and DDR4-3866 kits without RGB for $410 and $460, respectively.

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  • Acer’s Announces Predator Gaming Displays with Tobii Eye-Tracking Technology, Up to 240 Hz Refresh Rate (AnandTech)

    Acer has introduced three new Predator gaming monitors equipped with Tobii eye tracking technology at this week's IFA trade show in Berlin, Germany. The new screens are the first gaming displays to incorporate sensors from Tobii, but apart from them, they also offer very high refresh rates as well as NVIDIA’s G-Sync dynamic refresh rate technology.

    The Tobii EyeX technology was first demonstrated at CES 2013 (at the time it was called Tobii Gaze) as an alternative means of input from the traditional mouse or keyboard. The EyeX sensor is equipped with IR LEDs and an RGB camera to track eye positions and gaze points, where the EyeChip SoC as well as the EyeX software use the data from those sensors to control cursor in Windows or camera orientation in games. The polling rate of the EyeX sensor is 60 Hz and typical eye to application latency is specified to be around 15±5 ms. Tobii’s tech is compatible with Microsoft’s Windows Hello and typical Windows apps.

    While the eye tracking technology can speed up interaction with certain programs and even make life easier for people with disabilities, developers of software compatible with EyeX are primarily focused on games. In fact, there are around 40 games that support Tobii’s EyeX eye-tracking already (including Deus Ex: Mankind Divided and Tom Clancy’s The Division). Given the current positioning of the technology, it is absolutely logical for Acer to integrate the EyeX sensor into its Predator displays.

    Initially, Acer will offer three gaming monitors with built-in eye tracking: the Predator Z271T, the Predator XB251HQT and the Predator XB271HUT. All three displays feature NVIDIA’s G-Sync technology, but the manufacturer does not reveal exact dynamic refresh rate ranges. As for other peculiarities, all three monitors feature at least one DisplayPort 1.2 input as well as distinctive design with red and black color scheme.

    Acer Predator Displays with Tobii Eye Tracking Tech at Glance
      Predator Z271T Predator XB251HQT Predator XB271HUT
    Panel 27" VA 24.5" TN 27" TN
    Resolution 1920 × 1080 1920 × 1080 2560 × 1440
    Max Refresh Rate 144 Hz 240 Hz 165 Hz
    Curvature 1800R - -
    Inputs DisplayPort 1.2 Display Port 1.2
    Display Port 1.2
    Price €799 unknown €899

    The Acer Predator Z271T is based on a curved 27” VA panel with FHD (1920×1080) resolution and a 144 Hz maximum refresh rate. The product will be available in EMEA in October with prices starting at €799.

    Meanwhile the Acer Predator XB251HQT features a 24.5” TN panel with FHD (1920×1080) resolution, a 240 Hz refresh rate, and an ultra-thin bezel (which Acer calls ZeroFrame). The pricing and availability timeframe of this one remain unknown at this point.

    Finally, the Acer Predator XB271HUT has similar design to the XB251HQT (so, it has similar controls as well as the ZeroFrame ultra-thin bezen), but uses a 27” TN panel with WQHD (2560×1440) resolution and a maximum refresh rate of 165 Hz. Expect this display to be available sometimes in December for €899 in Europe.

    The monitors are not exactly affordable, but it's worth keeping in mind that the EyeX eye tracker costs $140/€119 when sold separately, and the displays feature rather high refresh rates along with G-Sync. Otherwise the integration of eye tracking into gaming monitors is an interesting move in general and a way to differentiate Predator displays from competing products. So it will be interesting to see whether the new screens will become popular among gamers, and how much of that market is willing to pay the price premium for the functionality.

  • Corsair Announces White Color Option for RM750x and RM850x Power Supplies (AnandTech)

    Corsair has announced a new color option for the RMx series power supplies, Arctic White. Readers with a watchful eye may remember that a while ago the company brought out a special edition of the RM1000i PSU in white. Now by popular demand, Corsair has made this a standard option for two of their PSUs, the RM750x and RM850x. 

    The newly redecorated power supplies are otherwise identical to their existing black-painted counterparts. This means they have fully modular cabling which can minimize the amount of wires users need to use, and see, in their cases allowing for a cleaner look. The cables come already individually sleeved in white with black connectors using three layers of paracord for each. Also something of note, one will find in-line capacitors on the ATX, EPS12V, and PCIe cables which Corsair says helps reduce ripple and noise, and improve voltage regulation.

    Features of the RMx series include a Zero RPM Fan Mode, where the rifle bearing 135mm fan sit idle during light to medium loads, only spinning up with heavy loads or at a specific temperature. On top of that The RMx line carries an 80 Plus Gold certification for efficiency, uses 100% all Japanese capacitors rated to 105C, and provides owners with a long 10 year warranty.

    Corsair RM750x and RM850x Specifications
      RM750x RM850x
    Rated Combined Rated Combined
    +3.3V 25A 150W 25A 150W
    +12V 62.5A 750W 70.8A 850W
    -12V 0.8A 9.6W 0.8A 9.6W
    +5Vsb 3A 15W 3A 15W
    Total Power 750W 850W
    Connector Type RM750x RM850x
    ATX 24 Pin 1
    EPS 4+4 Pin 1 2
    PCIe 6+2 Pin 4 6
    SATA 8 10
    4P Molex 7 8
    Floppy 1

    The Artic White versions will fetch a $10 premium over the traditional charcoal/black RMx models. They are priced at $149.99 for the RM750x and $169.99 for the RM850x at the Corsair Website. Finally, Corsair is also stating that at least for now, this is it for white RMx PSUs; there are no plans to produce the lower wattage RMx series power supplies in white.

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  • Was the iOS SSL Flaw Deliberate? (Schneier on Security)

    Last October, I speculated on the best ways to go about designing and implementing a software backdoor. I suggested three characteristics of a good backdoor: low chance of discovery, high deniability if discovered, and minimal conspiracy to implement.

    The critical iOS vulnerability that Apple patched last week is an excellent example. Look at the code. What caused the vulnerability is a single line of code: a second "goto fail;" statement. Since that statement isn't a conditional, it causes the whole procedure to terminate.

    The flaw is subtle, and hard to spot while scanning the code. It's easy to imagine how this could have happened by error. And it would have been trivially easy for one person to add the vulnerability.

    Was this done on purpose? I have no idea. But if I wanted to do something like this on purpose, this is exactly how I would do it.

    EDITED TO ADD (2/27): If the Apple auditing system is any good, they would be able to trace this errant goto line not just to the source-code check-in details, but to the specific login that made the change. And they would quickly know whether this was just an error, or a deliberate change by a bad actor. Does anyone know what's going on inside Apple?

    EDITED TO ADD (2/27): Steve Bellovin has a pair of posts where he concludes that if this bug is enemy action, it's fairly clumsy and unlikely to be the work of professionals.

  • Enermax Enters SFX Game with Revolution SFX PSUs (AnandTech)

    As small form-factor gaming PCs gain traction, more companies enter the scene with small form factor power supplies. Enermax this week introduced its first power supplies in SFX form-factor designed for high-performance systems. The company is now the fifth major supplier of PSUs to offer gaming-grade SFX power supplies, such that enthusiasts now have five brands to choose from, up from two early this year.


    The Enermax Revolution SFX family currently includes two models rated for 550 W (ERV550SWT) and 650 W (ERV650SWT) power output. The new PSUs are compliant with the SFX12V V3.3 and ATX12V V2.4 specifications as well as carry the 80 Plus Gold certification badge. The power supplies come in standard 100-mm depth chassis and feature 80-mm fans that do not operate at loads below 30% as well as a modular design with flexible flat-type cables to ensure easy cable management. Enermax also says that the new PSUs use Japanese electrolytic capacitors rated to handle 105°C temperature and have special protection circuitry to ensure durability and safety.

    Enermax Revolution SFX Series
    Connector type 550 W
    650 W
    ATX 24 Pin 1
    EPS 4+4 Pin 1
    PCI-E 6+2 Pin 2
    SATA 6
    4P Molex 4

    The Revolution SFX power supplies from Enermax have EPS12V power connectors (one 24-pin and a 4+4-pin connector), two PCIe 8-pin power connectors, six SATA power connectors and four 4P Molex plugs. The presence of two 8-pin (6+2) auxiliary power connectors makes the Revolution SFX compatible with virtually all high-end graphics cards released in the last couple of years, including NVIDIA’s GeForce GTX 1070/1080 that need only one 8-pin plug as well as AMD’s Radeon R9 Fury X that require two 8-pin power connectors. Not all gaming-grade SFX PSUs have two 8-pin power connectors and thus Enermax deserves a credit for this feature.

    Enermax Revolution SFX Series DC Output Specifications
      ERV550SWT ERV650SWT
    Rated Combined Rated Combined
    +3.3V 18 A 90 W 18 A 90 W
    +5V 15 A 15 A
    +12V 45.8 A 549.6 W 54 A 648 W
    -12V 0.3 A 3.6 W 0.3 A 3.6 W
    +5Vsb 3 A 15 W 3 A 15 W
    Total Power 550 W 650 W

    Both Revolution SFX PSUs come with an SFX to ATX adapter brackets and can be installed into SFX and ATX/Mini-ATX builds. The Revolution SFX 650 W is the most powerful SFX PSU in a 100-mm depth enclosure (SilverStone has 700 W SFX PSUs, but they are 30 mm deeper), hence, it is logical that it can be installed not only into tiny SFX cases, but into general gaming PCs as well. Truthfully, the amount of power connectors supported by both power supplies seems like an overkill for an SFX system, whereas the presence of four 4P Molex plugs indicates that the developers did not forget about those who use either special-purpose hardware.

    The Enermax Revolution PSUs are expected to hit the market shortly as typically announcements are made about a month ahead of actual availability (though, we do not know whether they are set to become available this year, in time for new PCs ahead of holidays). The 550 W version is set to cost $109.99, whereas the 650 W PSU is to be priced at $124.99.

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  • Epson révolutionne le modèle économique des imprimantes jet d'encre (MacBidouille)

    Depuis fort longtemps les fabricants d'imprimantes à jet d'encre ont créé un modèle économique biaisé.
    Plutôt que de vendre leurs imprimantes à leur juste prix, elles étaient bradées et les revenus étaient ensuite générés sur la vente de cartouches à des tarifs très élevés, transformant le litre d'encre en un des produits les plus coûteux au monde, loin devant les plus grands crus classés de Bordeaux.
    Cela a conduit à la prolifération des fabricants de cartouches compatibles et à des sécurisations de plus en plus complexes des imprimantes et des cartouches pour éviter les contrefaçons.

    Epson vient de décider de changer de business modèle et commercialise une nouvelle gamme d'imprimantes utilisant une technologie appelée EcoTank.

    Sous ce nom se cache une imprimante tout en un dotée d'un appendice sur le côté qui est en fait un gros réservoir (en fait quatre) d'encre.
    Il est suffisant selon la société pour imprimer pendant deux ans (4000 pages en noir et 6500 en couleur), soit la contenance de 20 jeux de cartouches.
    De plus, il est possible de recharger cette imprimante avec de gros flacons d'encre qui seront vendus à un faible prix.

    En échange, l'imprimante coûtera au moins 380$, soit à peu près le triple du prix habituel mais somme toute, c'est un bon deal qu'il faudra confirmer en calculant son coût par page.

    La société profite de ce nouveau business modèle pour lancer aussi des modèles à jet d'encre professionnels destinés à concurrencer les produit laser couleur.

    Ils sont dotés d'énormes réservoirs d'encre capables d'assurer l'impression de 20 000 pages en couleur ou autant en noir et vendus 1200$.
  • Windows 10 : une autre mise à jour poids plume à l'automne prochain ? (Génération NT: logiciels)
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  • Kingston Updates HyperX DDR4 Lineup with DDR4-3000, DDR4-3200 Modules (AnandTech)

    Following Intel’s announcement of the new Core i7 Broadwell-E lineup of HEDT processors with six, eight and ten cores, Kingston has recently refreshed its HyperX family of DDR4 memory modules. The new kits offer up to 64 GB capacities and run at data rates of up to 3333 MT/s with relatively low timings.

    The new Kingston HyperX Predator Black DDR4 memory modules feature 4 GB, 8 GB and 16 GB capacities and are offered in 8 GB, 16 GB, 32 GB and 64 GB dual-channel and quad-channel kits. Being designed primarily for quad-channel memory sub-systems (yet, compatible with all DDR4-supporting PCs), the modules will run at low data rates of 3000 MT/s, 3200 MT/s and 3333 MT/s (dual-channel only for 3333), and timings of CL15 for 3000 MT/s or CL16 for 3200/3333 MT/s. All modules are rated to operate at the recommended DDR4 enthusiast setting of 1.35 volts, which is higher than JEDEC’s recommendations, but is in line with the voltage of all high-end DDR4 memory sticks.

    Kingston HyperX Predator Black DDR4 DIMMs and Kits
    Data rate Latency Module Capacity Kit Capacity Number of Modules Voltage Part Number
    3000 MT/s CL15 4 GB 8 GB 2 1.35V HX430C15PB3K2/8
    4 GB 16 GB 4 HX430C15PB3K4/16
    8 GB 16 GB 2 HX430C15PB3K2/16
    8 GB 32 GB 4 HX430C15PB3K4/32
    16 GB 32 GB 2 HX430C15PB3K2/32
    16 GB 64 GB 4 HX430C15PB3K4/64
    3200 MT/s CL16 4 GB 8 GB 2 1.35V HX432C16PB3K2/8
    4 GB 16 GB 4 HX432C16PB3K4/16
    8 GB 16 GB 2 HX432C16PB3K2/16
    8 GB 32 GB 4 HX432C16PB3K4/32
    3333 MT/s CL16 8 GB 16 GB 2 1.35V HX433C16PB3K2/16

    To simplify setting the right clock-rates and timings on compatible Intel X99 and Intel 100-series motherboards, the HyperX Predator Black modules support XMP 2.0 SPD profiles. To maximize their cooling capabilities for overclocking, the memory sticks are equipped with aluminum heat spreaders. All of Kingston’s HyperX Predator Black DDR4 modules are validated to work with Skylake-S (i7-6700K etc), Haswell-E (5960X etc) and Broadwell-E (6950X etc) processors.

    Exact prices of the new HyperX Predator Black DDR4 memory modules from Kingston are unknown, but we expect them to be in line with similar components of these specifications.

  • Palit Launches GeForce GTX 1070 for Mini-ITX PCs with GALAX and KFA2 Brands (AnandTech)

    Palit has quietly released a GeForce GTX 1070-based video card for Mini-ITX systems under the GALAX and KFA2 brands. The product uses a unique PCB design and will be the third GeForce GTX 1070 graphics adapter for Mini-ITX PCs on the market.

    Just like competing GeForce GTX 1070s in an ITX form-factor, the GALAX GeForce GTX 1070 OC Mini and KFA2 GeForce GTX 1070 OC Mini graphics cards offer the same level of performance as a full-size GTX 1070. Both boards carry NVIDIA’s GP104 GPU (with 1920 stream processors, 120 texture units and 64 ROPs) that operates at 1518/1708 MHz (base/boost) as well as 8 GB of Micron’s GDDR5 memory running at 8 Gbps. While the card runs a bit faster than NVIDIA’s reference frequencies (+12/25 MHz for base/boost frequencies), its TDP remains the same at around 150W.

    Both video cards use the same PCB design with a 4+1 VRM and one 8-pin PCIe power connector, which is inline what NVIDIA’s reference boards offer. The VRM uses solid-state chokes, whereas its MOSFETs are cooled down by a separate heatsink. The main cooling system features a copper base, three thick nickel-plated heat pipes, a relatively large aluminum radiator, two fans and a metal cover. In fact, the cooler is larger when compared to cooling systems of some other Mini-ITX graphics cards and the adapter itself is a bit longer when compared to direct rivals (195/181 mm with/without a bracket, whereas a mini-ITX motherboard is 170mm).

    The dimensions of the GALAX/KFA2 GeForce GTX OC Mini cards are not going to become a problem in the vast majority of situations where a good performance mini-ITX gaming PC is concerned, however some users aiming at very small form-factor builds may end up finding it a tight squeeze.

    As for connectivity, Palit decided to offer something different from NVIDIA’s reference designs and appeal to owners of older monitors (who use more than one of them) with DVI interface. Both cards are equipped with one DisplayPort 1.4 connector, an HDMI 2.0b port as well as two dual-link DVI-D ports. By contrast, NVIDIA-designed boards come with two DPs, an HDMI and only one DVI header.

    Specifications of GeForce GTX 1070 for Mini-ITX PCs
      GALAX GeForce GTX 1070 OC Mini KFA2 GeForce GTX 1070 OC Mini ZOTAC GeForce GTX 1070 Mini GIGABYTE GeForce GTX 1070 Mini-ITX NVIDIA
    GeForce GTX 1070
    Founders Edition
    Stream Processors 1920
    Texture Units 120
    ROPs 64
    Core Clock (MHz) 1518 1531 - 1556 1506
    Boost Clock (MHz) 1708 1721 - 1746 1683
    Memory Capacity 8 GB
    Type GDDR5
    Clock 8 Gbps
    TDP 150 W
    Length 195 mm 210 mm 169 mm 280 mm
    Launch Date Q1-2017 12/2016 7/2016 6/2016
    Launch Price unknown $395 unknown $449

    Palit did not announce MSRP and ETA of its GALAX GeForce GTX 1070 OC Mini and KFA2 GeForce GTX 1070 OC Mini boards, but given that they are listed at respective web sites, expect them to show up on the shelves in the coming weeks. Meanwhile, as examples of other high-end Mini-ITX graphics cards show, the GPU manufacturers do not tend to charge a much more for an SFF card and prices of such adapters are very close to NVIDIA’s MSRPs (which for the GTX 1070 is $379).

    Related Reading:

    Sources: GALAX, KFA2.

  • OneDrive : un partage de fichiers simplifié dans Windows et macOS (Génération NT: logiciels)
    Microsoft va proposer une nouvelle interface de partage pour OneDrive dans l'Explorateur de fichiers de Windows et le Finder de macOS.
  • Corsair Announces 16GB DDR4-4600 Vengeance LPX DRAM Kits (AnandTech)

    Corsair on Thursday announced two fresh Vengeance LPX memory kits that set new performance records for the product family. The new dual-channel memory kits are intended for Intel’s Kaby Lake-X CPUs and Intel’s X299 platforms, and they operate at DDR4-4500 and DDR4-4600 MT/s data transfer rates and require over 1.4 V.

    Corsair’s new fastest-ever DDR4 memory kits have a combined capacity of 16 GB and are rated for DDR4-4500 with CL19-19-19-39 timings at 1.45 V and for DDR4-4600 at CL19 26-26-46 at 1.5 V. Corsair verified stable performance of its DIMMs at transfer rates well beyond those recommended by JEDEC using an Intel Kaby Lake-X CPU and ASRock’s X299 OC Formula motherboard. The OC Formula motherboard only runs at one DIMM per channel (vs. 2 DPC on most X299 mainboards) in a bid to guarantee a  “cleaner” data path and stable power supply to maximize overclocking potential for DRAM. Given the increased speeds and required overvoltage over the standard, the quality of the motherboard DRAM VRM becomes crucial for stability in case of DDR4-4500 and DDR4-4600 modules. For the same reason, Corsair does not equip its ultra-fast Vengeance LPX DIMMs with RGB LEDs because they may affect power supply and stability.

    The new Corsair Vengeance LPX DDR4-4500 and DDR4-4600 memory kits are based on Samsung’s B-die, produced using 20 nm process technology. These memory ICs have been used by makers of leading-edge DDR4 memory modules (Corsair, G.Skill, GeIL, etc.) for a couple of years and by now they all know what to expect from these devices even in extreme conditions, such as operation with a 20 or 25% overvoltage.

    The new Vengeance LPX memory modules from Corsair come with regular black aluminum heat spreaders that work well with all types of CPU coolers. The embedded XMP 2.0 SPD settings to make it easy for end users to set up correct timings and sub-timings.

    Corsair's 'Extreme' Vengeance LPX Memory for Intel's X299 Platform
    Speed CL Timing Voltage Kit Capacity P/N
    DDR4-4500 CL19 19-19-39 1.45 V 2×8 GB 16 GB CMK16GX4M2F4500C19
    DDR4-4600 CL19 23-23-43 1.5 V CMK16GX4M2F4600C19

    Corsair’s new Vengeance LPX 16 GB (8 GB×2) DDR4-4500 and DDR4-4600 kits are going to hit the market in the coming days, and they are going to be expensive. The DDR4-4500 kit will retail at $479.99, whereas the DDR4-4600 kit will retail for $549.99.

    Related Reading

  • Apple propose la 10.13.4 beta 6 aux développeurs (MacBidouille)

    Apple a mis à la disposition des développeurs la sixième beta de la 10.13.4.

    Les changements apportés ne sont pas encore connus.

  • Apple 2017: The iPhone X (Ten) Announced (AnandTech)

    The hot button item expected to come from Apple’s announcement today was the set of iPhones being announced. The iPhone 8 and iPhone 8 Plus were the expected models to come to market, but Apple felt that for the 10-year anniversary since the launch of the original iPhone, it should release a new model which ‘breaks the standard for another 10 years’. This new iPhone X device goes all in on some significant features that are novel to the Apple smartphone ecosystem: an edge-to-edge OLED display, a TrueDepth front-facing camera system, removal of TouchID in favor of a new facial recognition system called FaceID, and a few new features surrounding the integrated neural engine inside the A11 SoC.

    The iPhone X (pronounced iPhone Ten) is a visually significant departure from previous Apple smartphones. The 5.8-inch display is called an ‘edge-to-edge’ display in the marketing material, citing minimal bezels and taking up pretty much the full real estate of the phone. Apple also dubs this as a new retina display, specifically a ‘Super Retina’ display, with a 2436x1125 resolution with a pixel density of 458 PPI. The display is Apple’s first foray into OLED technology on a smartphone, as ‘previous versions of OLED were not sufficient’ in previous generations. This means that Apple is promoting features such as HDR10 for high dynamic range, a 1000000:1 contrast ratio, and high color accuracy. That contrast ratio is due to the blacks provided by the OLED display, although it will be interesting to see what the practical limits are. Apple has always been consistent with having superb color accuracy on its smartphones, so we will have to see in our testing if OLED changes things in Apple’s qualification process. Also Apple’s TrueTone technology makes its way from the iPad to the iPhone. This display technology uses data from the ambient light sensor to detect the ambiance of the surroundings and adjust colors (particularly when reading black on white) and adjusting the display to make it easier to read. The display will also support 3D Touch.

    With Apple moving to a full-screen technology like this, there is no room for the standard Home button, and with it, TouchID. As a replacement/upgrade, Apple is implementing FaceID: a set of front-facing technologies that will develop a face-map of a user and embed that as the passcode. This functionality is likely derived from Apple’s acquisitions of PrimeSense in 2013 (the IP behind Microsoft Kinect) and FaceShift in 2015. Apple states that the technology uses its embedded neural network engine to speed up facial recognition, but also that algorithms are in place such that the system will work if a user puts on glasses, wears a hat, has different hair, and even in low light. The algorithms will also auto-update as a user grows a beard. A lot of security researchers have questioned this move, while Apple quotes that the possibility for a false positive on TouchID was around 50k-to-1, FaceID should be more similar to a million-to-one. With FaceID, users will be able to unlock the device, as well as use their face to preapprove ApplePay purchases before touching a pay pad.

    In order to enable FaceID, Apple implemented a small top area for the main hardware. This includes an infrared camera, a flood illuminator, the front camera, and a dot projector. The hardware will map the face in three dimensions with a 5-second startup (when in sufficient light) to produce a face mesh. One version of the mesh, with the textures as part of the algorithm, will be held in a secure enclave for identification and approval. At this point in time, only one face per device can be registered, marking an initial limitation in the hardware. One of the other features for the technology shown by Apple was the ability to generate a face mesh and map new textures to it, such as new SnapChat ‘masks’, or animated emoji in Message. The hardware will map 50 muscle tracking points, and a user can choose one of twelve animal emoji (fox, cat, dog, pig, unicorn, poop emoji) and record a ten second message where the ‘ani-moji’ will mimic in real-time how the user is moving and speaking in order to send to the other person. Apples plan here is to open the resources up to developers to use in their own applications.

    Because the FaceID hardware is essentially an indent into the display, there will be some issues on content that will have to be addressed. On the home screen, Apple has designed the top icons to be inside the two nooks either side of the FaceID hardware, and adjust as needed. As shown by several journalists on the show floor at the launch event, the video will naturally default to fit perfectly without the little nooks, but if a user selects full screen, it will wrap around the FaceID hardware and intrude into the video being watched. Apple usually prides itself in the simplicity in its display support, and this might be a little scratch in that armor.

    With no home button, Apple is having to implement new interactions to deal with regular home button actions. To wake the phone from a screen off state, a user can tap on the display (or use FaceID if setup). To get to the home screen, the user can swipe up in any application, although this seems a bit fraught with issues, especially with games where swiping up is a key mechanic of the application. In order to get the list of applications in memory, then swipe up but hold the finger down on the screen. Apple neglected to mention how to put the phone to sleep / screen off mode – there is a button on the side, but that is specifically for Siri. In order to get the notifications menu, swipe down from the top.

    Under the hood, Apple is using its new A11 Bionic processor, with significant upgrades over the A10 and A10X. Details were scarce, but this is a TSMC 10nm design featuring six cores: two high-performance cores and four power efficient cores, with all six cores available for use at the same time. Apple is quoting that the high-performance cores are 25% faster than the high-performance cores in A10, while the high-efficiency cores are 70% faster than their counterparts in A10. No speeds are details about the cores were provided, though some initial analysis online from the code base suggests that the larger cores have two levels of private cache, while the smaller cores only have one level of private cache, with a high level of shared cache between both sets before hitting the DRAM. The A11 SoC will come in at 4.3 billion transistors, and features Apple’s second generation performance controller to assist with the 2+4 configuration. Also involved is a new GPU, which Apple states is its own custom design, coming in at ‘three cores’ (whatever that means in this context) and offers 30% higher performance than the graphics in the A10. Apple also stated that it can offer A10 graphics for half the A10 power, and that the GPU can assist in machine learning. We’ve seen discussions on Apple’s Metal 2 compute already appear at WWDC, so this is likely what Apple is talking about. The SoC also features a new ‘Neural Engine’ inside, offering two cores and 600 Giga-Ops per second, although no information as to how this inference hardware operates or at what precision (for example, Huawei’s NPU gives 1.92 TFLOPs of FP16). Apple was very light on A11 details, so we’ll likely revisit this topic later with more details.

    For the camera system, Apple is using a vertical dual camera on the rear of the iPhone X, rather than the horizontal cameras on the iPhone 7 Plus and iPhone 8 Plus. Both of these cameras are new models, both are 12 megapixels, and both come with optical image stabilization. One camera is f/1.8, while the other is f/2.4, with both having larger and faster sensors with deeper pixels than previous iPhones to aid in image focus. Like with the iPhone 8 and iPhone 8 Plus, Apple will use the embedded Neural Engine to assist with photo taking, such as adjusting skin-tone mapping in real-time depending on the environment. The camera also supports dual Quad-LED flash.

    The full design is glass on the back and front, using a new technology that Apple is quoting as the most shatter-resistant glass on an iPhone, and the band in the device will be ‘surgical grade stainless steel’ rather than aluminum. The iPhone X will be dust and water resistant, although Apple stopped short of giving it a full IPXX rating. Due to the glass, Apple is equipping the iPhone X with wireless charging capabilities using the Qi standard, and will offer a large ‘Air Power’ pad in 2018 that will allow users to wireless charge the iPhone X, the new Apple Watch Series 3, and the Air Pods all at the same time. Apple did not go into the size of the battery, although it does quote it as having two hours more battery life than the iPhone 7, despite the large OLED display.

    Lots of features that we’ve seen discussed in previous Apple launches were glossed over here: changes in the haptic feedback, anything about audio (there’s no 3.5mm jack, if you were wondering), any hard performance metrics, SoC details about the cores and how/if they are different, or frequencies, or how the Neural Engine is laid out, or even how much DRAM is in the device. This is likely due to the fact that even for a two-hour presentation, time was spent detailing the new features more than the underlying hardware. Unlike other smartphone vendors or chip designers, Apple doesn’t do a deeper ‘Tech Day’ on their hardware, which is a shame.

    What we do know is that Apple will be offering two storage options, 64GB and 256GB, and two colors in Space Grey and Silver (both of which have a slight pearlescence, according to Apple). The 64GB model will start at $999, and include Ear Pods in the box. The 256 GB model will have some markup, although Apple did not disclose how much. The iPhone X will go up for pre-order on October 27th in around 30 countries, and ship on November 3rd.

    Additional: turns out there are a lot more specifications on Apple's product page that just went live. Key features are screen brightness (625 nits), dimensions (143.6 x 70.9 x 7.7 mm, 174 grams), native FLAC support and HDR video playback support. The 256 GB model will start at $1149, putting a $150 mark-up on the higher capacity, and the Lightning-to-3.5mm cables are still included in the box.

    Apple iPhone
      iPhone 7 iPhone 7 Plus iPhone 8 iPhone 8 Plus iPhone X
    SoC Apple A10 Fusion
    2 x 2.3 GHz Hurricane
    2 x little cores
    Apple A11 Bionic
    2 x High-Perf
    4 x High Efficiency
    GPU 6 Core PowerVR GPU 3-Core Apple Custom 
    Display 4.7-inch
    1334 x 750
    1920 x 1080
    1334 x 750
    1920 x 1080
    Size / Mass 138.3 x 67.1 x 7.1 mm
    138 grams
    158.2 x 77.9 x 7.3 mm
    188 grams
    138.4 x 67.3 x 7.3 mm
    148 grams
    158.4 x 78.1 x 7.5 mm
    202 grams
    143.6 x 70.9 x 7.7mm
    174 grams
    Battery 1960 mAh
    2900 mAh
    ? ? +2hr over iPhone 7
    Wireless Charging - - Qi Qi Qi
    Rear Cameras 12 MP f/1.8, OIS
    Wide Color Gamut
    Quad LED True Tone Flash
    12 MP, f/1.8, OIS
    Wide Color Gamut
    Quad LED True Tone Flash
    - 12MP ƒ/2.8 Telephoto,
    2x Optical
    Portrait Mode
    - 12 MP f/2.8
    2x Optical
    Portrait Mode,
    Portrait Lighting
    12 MP f/2.4 Telephoto, OIS
    2x Optical
    Portrait Mode,
    Portrait Lighting
    Front Camera 7MP ƒ/2.2
    Wide Gamut
    Retina Flash
    7MP ƒ/2.2
    Wide Gamut
    Retina Flash
    7MP f/2.2
    Wide Gamut
    Retina Flash
    Portrait Mode,
    Portrait Lighting
    Storage 32 / 128 / 256 GB 64 / 256 GB
    I/O Apple Lightning connector Apple Lightning connector
    WiFi 2.4 / 5GHz 2T2R 802.11a/b/g/n/ac, NFC
    BlueTooth 4.2
    2.4 / 5GHz 2T2R
    802.11a/b/g/n/ac, NFC

    BlueTooth 5.0
    Launch Price 32 GB: $649
    128 GB: $749
    256 GB: $849
    32 GB: $769
    128 GB: $869
    256 GB: $969
    64 GB: $699
    256 GB: $849
    64 GB: $799
    256 GB: $949
    64 GB: $999
    256 GB: $1149



  • Le Galaxy S8 misera gros sur son assistant numérique (MacBidouille)

    SamMobile (via engadget) a obtenu des informations sur le Galaxy S8 et en particulier son assistant numérique intégré, qui sera dérivé du rachat de Viv. Il devrait s'appeler Bixby et sera capable d'interagir avec toutes les applications du mobile.
    Fondamentalement, il sera capable de faire des choses proches de ce que réalise Siri ou l'assistant de Google, assez en tout cas pour permettre à Samsung de rentrer de plain pied dans le club de ceux qui ont des assistants numériques dignes de ce nom et éviter que ses clients n'utilisent un système concurrent.

    Tous les géants cherchent à avoir le meilleur assistant, le plus pertinent, le plus intelligent car il représentera à terme un moyen de fidéliser les clients sur leur plateforme et un jour sera un nouveau vecteur de revenus publicitaires.

  • MAINGEAR Launches R2 Razer Edition: Mini-ITX System with AMD Ryzen or Intel Core i7 (AnandTech)

    MAINGEAR this week introduced the first small form-factor Razer Edition desktop aimed at loyal clients of Razer. The new MAINGEAR R2 Razer Edition uses AMD’s and Intel’s latest platforms and comes with a lot of green lights, green coolant, and other green features to reflect the company’s main color.

    Razer has made quite a name for itself over the years in the gaming laptop market, but instead of entering the desktop business, the company decided to collaborate with renowned system builders to produce "Razer Edition" PCs. This enables Razer to offer Razer-branded desktops customers without entering a highly competitive market, whereas its partners gain access to Razer’s customer base. So far, Razer has collaborated with Lenovo and MAINGEAR for tower gaming desktops aiming mainstream and no-compromise gamers. With the MAINGEAR R2 Razer Edition, the two companies offer something for those who are looking for a miniature system featuring extreme components with further overclocking potential and liquid cooling.

    The MAINGEAR R2 Razer Edition is a Mini-ITX desktop that can fit in a motherboard based on AMD’s B350 or Intel’s Z270 chipset as well as an AMD Ryzen R5/R7 or Intel Core i5/i7 CPU respectively. Keeping the form-factor in mind, the R2 Razer desktop can fit in one graphics card (up to NVIDIA’s Titan Xp), one 3.5” or two 2.5” storage devices, as well as one M.2 PCIe 3.0 x4 NVMe SSD. Unlike many contemporary gaming desktops, the MAINGEAR R2 can accommodate a 5.25” ODD, and when equipped with an appropriate drive, can playback Blu-ray disks.

    When it comes to the motherboard choice, MAINGEAR offers ASRock AB350 Gaming-ITX/ac for use with AMD's Ryzen processors or ASUS ROG Strix Z270I Gaming or MSI Z270I Gaming Pro Carbon AC for Intel’s Core i7 CPUs. All of the motherboards feature GbE, 802.11ac Wi-Fi, Bluetooth 4.2, 7.1-channel audio, as well as USB 3.1 connectivity. MAINGEAR’s product brochure for the R2 also mentions ASRock’s X99 Mini-ITX motherboard, but at this point, it is impossible to order such a system, which is not surprising as this is an outgoing platform.

    Cooling is crucially important for high performance gaming PCs and MAINGEAR offers many options for the R2 Razer Edition. For entry-level builds, MAINGEAR can install AMD’s or Intel’s retail CPU coolers and keep stock cooling systems on the GPU. For something more advanced, the company offers the closed loop EPIC 240 LCS for the CPU. For high-end configurations MAINGEAR can also build a custom open loop LCS for both the CPU and GPU featuring soft tubing and a 360 mm radiator, whereas for ultra-high-end builds the PC maker can design a custom LCS with crystal or metal hardline tubing, chrome fittings, and other stylish components.

    MAINGEAR’s R2 Razer Edition desktops are now available from the company’s web site. Entry-level machines featuring AMD's Ryzen R5 or Intel's Core i5 start at $1099 and $1199, respectively. Meanwhile, SuperStock configurations featuring a customized LCS with hardline tubing and top-of-the-range CPUs and GPUs start at $4299 or $4399 depending on the platform.

    Related Reading:

  • Le MacBook Pro 16" pourrait arriver en septembre (MacBidouille)

    Selon de nouvelles rumeurs, le MacBook Pro doté d'un écran 16" et d'un tout nouveau design, dont on parle depuis quelques mois, pourrait être présenté en septembre
    La dalle aura une définition 4K et cette machine ne fonctionnera que sous Catalina.
    Si au niveau processeur ces machines auront droit aux mêmes processeurs que les Retina 15" 2019, nous ne serions pas surpris qu'Apple donne à ces machines de nouvelles cartes graphiques.

    Comme d'habitude, on pourra certainement s'attendre à atteindre de nouveaux sommets tarifaires, Apple surfant de record en record dans ce domaine depuis que les chiffres de vente ne permettent plus d'en atteindre.

  • Raja Koduri, Head of AMD's RTG, to go on Sabbatical until December (AnandTech)

    Late last night, PC Perspective confirmed rumors that Raja Koduri, AMD's Radeon Technologies Group (RTG) Senior Vice President and Chief Architect, is to go on sabbatical. Sourcing Raja’s internal letter to the RTG team, he will be taking leave from September 25 until an unspecified date in December, to spend time with his family. Dr Lisa Su, AMD's CEO, will lead RTG in the interim.

    As reproduced by Ryan Shrout, Raja’s letter is as follows:

    RTG Team,

    You haven’t heard from me collectively in a while – a symptom not only of the whirlwind of launching Vega, but simply of the huge number of demands on my time since the formation of RTG. Looking back over this short period, it is an impressive view. We have delivered 6 straight quarters of double-digit growth in graphics, culminating in the launch of Vega and being back in high-performance. What we have done with Vega is unparalleled. We entered the high-end gaming, professional workstation and machine intelligence markets with Vega in a very short period of time. The demand for Vega (and Polaris!) is fantastic, and overall momentum for our graphics is strong.

    Incredibly, we as AMD also managed to spectacularly re-enter the high-performance CPU segments this year. We are all exceptionally proud of Ryzen, Epyc and Threadripper. The computing world is not the same anymore and the whole world is cheering for AMD. Congratulations and thanks to those of you in RTG who helped see these products through. The market for high-performance computing is on an explosive growth trajectory driven by machine intelligence, visual cloud, blockchain and other exciting new workloads. Our vision of immersive and instinctive computing is within grasp. As we enter 2018, I will be shifting my focus more toward architecting and realizing this vision and rebalancing my operational responsibilities.

    At the beginning of the year I warned that Vega would be hard. At the time, some folks didn’t believe me. Now many of you understand what I said. Vega was indeed hard on many, and my sincere heartfelt thanks to all of you who endured the Vega journey with me. Vega was personally hard on me as well and I used up a lot of family credits during this journey. I have decided to take a time-off in Q4 to spend time with my family. I have been contemplating this for a while now and there was never a good time to do this. Lisa and I agreed that Q4 is better than 2018, before the next wave of product excitement. Lisa will be acting as the leader of RTG during by absence. My sincere thanks to Lisa and rest of AET for supporting me in this decision and agreeing to take on additional workload during my absence.

    I am looking to start my time-off on Sept 25th and return in December.

    Thank you, all of you, for your unwavering focus, dedication and support over these past months, and for helping us to build something incredible. We are not done yet, and keep the momentum going!

    Regards, Raja

    Since his return to AMD in 2013 and the reformation of a monolithic graphics division with RTG in 2015, Raja has overseen and led all aspects of AMD graphics hardware and software. Raja’s public presence and involvement render him the face of graphics at AMD, in all senses of the word, from Capsaicin events to Twitter and Reddit. Following Vega’s launch, Raja had taken two weeks vacation to visit family, following visits to company sites in India.

    Given the news in his letter, we hope all is well.

  • Qualcomm Announces Snapdragon X20 LTE Modem & New RF Front-End Modules For Mobile Devices (AnandTech)

    Qualcomm announced its first LTE Advanced Pro modem, the X16 LTE, last February, supporting downlink speeds of up to 1.0 Gbps. Today the company announced its second-generation gigabit class LTE modem, the Snapdragon X20 LTE, along with some new RF front-end components.

    The Snapdragon X20 LTE modem will use Samsung’s latest 10nm LPE process and offer a few key enhancements over the X16 LTE modem integrated into the Snapdragon 835 SoC. First, the X20 gains support for 5x carrier aggregation (5x20MHz), allowing for more flexible use of available licensed and unlicensed spectrum with over 1000 possible carrier aggregation band combinations. It also increases the number of usable spatial streams from 10 to 12 by performing 4x4 MIMO on three aggregated carriers. These improvements allow the X20 to support UE Category 18 on the downlink, boosting peak theoretical bandwidth to 1.2 Gbps, a 20% improvement over the X16 LTE modem. Uplink bandwidth remains the same, however, supporting up to 150 Mbps with 2x20MHz carrier aggregation and 64-QAM.

    Improving performance was not Qualcomm’s primary goal for X20, though; by supporting 5x carrier aggregation (CA) and Licensed Assisted Access (LAA), an LTE Advanced Pro feature that allows CA of licensed and unlicensed spectrum (5 GHz) on the downlink, the X20 allows network operators to deploy gigabit LTE service with only 10MHz of licensed spectrum. This is vitally important in many crowded markets where 20MHz blocks are rare. According to a Strategy Analytics study, 64% of network operators around the globe can deploy gigabit LTE using 20MHz CA and LAA, the configuration offered by the Snapdragon X16 LTE modem. This number increases to 90% when using 10MHz CA and LAA, making gigabit LTE a viable bridge to 5G.

    Qualcomm Snapdragon 4G LTE Modems (High-End)
    Modem Snapdragon X20 LTE Snapdragon X16 LTE Snapdragon X12 LTE


    Snapdragon 835

    Snapdragon 820/821

    UE Category Cat 18 DL
    Cat 13 UL
    Cat 16 DL
    Cat 13 UL
    Cat 12 DL
    Cat 13 UL
    Peak Bandwidth 1.2 Gbps DL
    150 Mbps UL
    1.0 Gbps DL
    150 Mbps UL
    600 Mbps DL
    150 Mbps UL
    CA Config 5 x 20MHz DL
    2 x 20MHz UL
    4 x 20MHz DL
    2 x 20MHz UL
    3 x 20MHz DL
    2 x 20MHz UL
    MIMO 4x4 (3 CA) 4x4 (2 CA) + 2x2 (1 CA) 4x4 (1 CA)
    Max Spatial Streams 12 10 6
    Modulation 256-QAM DL
    64-QAM UL
    Cellular Technologies LTE FDD / LTE TDD / LTE-U / WCDMA / TD-SCDMA / CDMA / GSM
    Additional Features LAA, CBRS, VoLTE, EVS, Wi-Fi calling, Dual SIM Dual Standby, Dual SIM Dual Active, Dual SIM Dual VoLTE LAA, CBRS, VoLTE, EVS, Wi-Fi calling, Dual SIM Dual Standby, Dual SIM Dual Active VoLTE, EVS, Wi-Fi calling, Dual SIM Dual Standby
    Mfc. Process 10nm LPE 10nm LPE / 14nm LPP 14nm LPP

    The Snapdragon X20 and X16 LTE modems share several features, including LTE Broadcast and Ultra HD Voice quality using the EVS codec. Both modems also support Citizens Broadband Radio Service (CBRS) in the US, a 150MHz slice of shared spectrum in the 3.5GHz band that can be used by operators for gigabit LTE service or even private LTE networks for industrial or large-campus applications.

    One new feature exclusive to the X20 is Dual SIM Dual VoLTE (DSDV), a technology that will help carriers transition away from legacy GSM networks. With DSDV the second SIM is no longer limited to 2G or 3G voice duties, because voice can be carried over LTE. It also allows the user to select either SIM for LTE data service.

    Like previous Qualcomm LTE modems, the Snapdragon X20 will be offered as a stand-alone product initially, but will likely be integrated into a high-end Snapdragon SoC next year. Qualcomm has begun sampling the new modem to customers and expects the first commercial devices to appear in the first half of 2018.

    New RF Front-End (RFFE) Components

    Qualcomm also added several new products to its RF360 portfolio, including several new power amplifier modules and its next-generation TruSignal solution. The new components promise to reduce power consumption and improve signal quality, leading to better battery life and more consistent cellular performance under a broad range of conditions. They also adhere to Qualcomm’s philosophy of creating highly integrated RFFE components that reduce part count and simplify RF design for OEMs.

    The four new multimode, multiband power amplifier (MMPA) modules—QPA5460, QPA5461, QPA4360, QPA4361—are the first from Qualcomm to use GaAs as opposed to CMOS, which brings certain advantages when working with higher frequencies. The primary difference between the QPA54xx parts and the QPA43xx parts is that the former uses envelope-tracking when paired with a QET4100 envelope tracker IC and provides better power efficiency for LTE TDD networks, while the latter is optimized for average power tracking. All four MMPA modules combine switches with low, mid, and high band power amplifiers into a tightly integrated package.

    Qualcomm also released the D5328 Integrated Front-End Module (FEMiD) and D5285 Diversity Receive Module (DRX), both of which increase RFFE integration. The D5328 FEMiD combines layer-transfer switches, certain filters, duplexers, and a quadplexer into a single module, while the D5285 DRX is a similar part for the diversity receive path.

    Qualcomm’s latest TruSignal adaptive antenna tuning solution, which combines the QAT3550 impedance tuner, QAT3514 aperture tuner, and QAT3522 antenna diversity switch, is the first to support carrier aggregation. The components work together with the modem, which provides advanced signal processing, in a closed-loop system to ensure optimal signal quality. The third-generation QAT3550 is 30% smaller than the second-generation QFE2550 impedance tuner, and all three QAT35xx parts can be used in conjunction with the Snapdragon 835 SoC.

  • ASRock Announces the X299 OC Formula Motherboard (AnandTech)

    Back in May of this year, we saw our first glimpse of the X299 OC Formula, ASRock’s to-be high-end overclocking focused motherboard. In the past couple of generations, the OC Formula line was black and yellow. For X299 it has changed to black with some gray. Though it looks like most other X299 boards on the shelves, ASRock positions it as “…ideally focused on overclocking exclusively, without any other useless features, designs or gimmicks.” 

    One major change to previous OC Formula (OCF) boards of the past is the reduction down to one memory slot per channel. Most X299 based boards have eight slots; while the X299 OCF has four. Since the board is aimed towards overclocking, previous boards have shown one memory slot per channel has overclocking benefits, so the transition is made on the X299 version. Most users aren’t looking for the full 128GB capacity anyway, as this can put a ceiling on how fast your ram runs. ASRock states the board design aids in stability and reaching higher memory speeds, with up to DDR4 4600 (OC) officially supported out of the box, which is among the highest we have seen so far for X299. ASRock’s own in-house overclocker Nick Shih, who has helped design the OCF line for many years, has achieved DDR4-4800 with only air cooling on some high-end premium and binned memory. The X299 OC Formula will also support soon-to-be-announced DDR4-4500 XMP profile modules that will appear on the market soon. 

    As with past OC Formula boards, the X299 version carries over the ASRock Formula Kits (Power Kit, Connector Kit, and Cooling Kit). The 'kits' are marketing speak for features found on the board. Items such as the all DigiPower VRM design with Dr. MOS MOSFETs, a Hi-Density power 8-pin EPS connector, 15µ gold contacts, 8-layer 2oz copper PCB and the heat pipe configuration for the large VRM heatsinks, are all part of that feature package. ASRock says this heat sink configuration can supports up to 450W from the VRMs with proper airflow. The same 13 phase VRM found on the X299 Taichi and the Gaming i9 makes its way to the OC Formula as well. 

    Other overclocking features include an LN2 mode switch (disables CPU thermal protection, enables additional OC features), Rapid OC buttons to manually adjust the CPU ratio, the BCLK frequency, or the CPU voltages directly on the board. There are also PCIe on/off switches to disable PCIe slots, and the retry/reset/BFG button set for quick access to different types of restarts and boots. These features are found in the upper right-hand corner of the board above the ATX power. For those not wanting to manually overclock and play, the UEFI also has several of Nick's preset overclocking profiles. These range from 4 GHz all the way to extreme overclocking (liquid nitrogen, LN2) profiles. If BCLK adjustment is needed, the X299 OCF also comes with an additional external base clock generator, the Hyper BCLK Engine III. It is designed to support PCIe frequency overclocking and a wider range of BCLK frequency adjustments. 

    Outside of overclocking centered features, the board supports 4-Way SLI and Crossfire in its five full-length PCIe slots, has dual PCIe 3.0 x4 M.2 slots supporting both PCIe and SATA based M.2 modules, eight SATA ports, dual Intel Gigabit LAN ports, and uses the latest Realtek ALC1220 audio codec with ASRock’s Purity Sound 4 software. For those looking for RGB LEDs, the X299 OCF does have them under the PCH heatsink only.

    ASRock X299 OC Formula
    Warranty Period 3 Years
    Product Page Link
    Price N/A
    Size ATX
    CPU Interface LGA2066
    Chipset Intel X299
    Memory Slots (DDR4) Four DDR4
    Supporting 64GB
    Quad Channel
    Up to 4600 MHz (OC)
    Network Connectivity 1 x Intel I219V GbE
    1 x Intel I211AT GbE
    Onboard Audio Realtek ALC1220
    PCIe Slots for Graphics (from CPU) 5 x PCIe 3.0
    44 Lane CPU - x16/x0/x0/x16/x8 or x8/x8/x8/x8/x8
    28 Lane - x16/x0/x0/x8/x4 or x8/x8/x0/x8/x4
    16 Lane - x16/x0/x0/x0/x4 or x8/x0/x0/x8/x4
    PCIe Slots for Other (from PCH) 1 x PCIe 3.0 x1
    1 x PCIe 3.0 x4
    Onboard SATA 6 x SATA3 - Supports RAID 0/1/5/10
    2 x SATA3 - Supports NCQ, AHCI, and Hot Plug via Asmedia ASM1061
    Onboard SATA Express None
    Onboard M.2 2 x PCIe 3.0 x4 (SATA also supported)
    Onboard U.2 None
    USB 3.1 Gen 2
    USB 3.1 (10 Gbps)
    1 x Type-A (ASMedia ASM3142)
    1 x Type-C (ASMedia ASM3142)
    USB 3.1 Gen 1​
     USB 3.0 (5 Gbps)
    4 x Rear Panel
    2 x via headers (ASM1074 Hub)
    USB 2.0 2 x Rear Panel
    4 x via headers
    Power Connectors 1 x 24-pin ATX
    1 x 8-pin CPU
    1 x 4-pin CPU (Optional)
    Fan Headers 1 x CPU (4-pin)
    1 x CPU Opt/Water Pump
    2 x Chassis Fan
    1 x Chassis Opt/Water Pump
    IO Panel 1 x PS/2 Mouse/Keyboard Port
    1 x Optical SPDIF Out Port
    2 x USB 2.0 Ports
    1 x USB 3.1 Type-A Port (10 Gb/s) 
    1 x USB 3.1 Type-C Port (10 Gb/s) 
    4 x USB 3.0 Ports 
    2 x RJ-45 LAN Ports
    1 x BIOS Flashback Switch
    1 x Clear CMOS Switch
    HD Audio Jacks

    Pricing or details on availability were not listed at the time of publication.

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