Divers

  • Apple 2017: The iPhone X (Ten) Announced (AnandTech)

    The hot button item expected to come from Apple’s announcement today was the set of iPhones being announced. The iPhone 8 and iPhone 8 Plus were the expected models to come to market, but Apple felt that for the 10-year anniversary since the launch of the original iPhone, it should release a new model which ‘breaks the standard for another 10 years’. This new iPhone X device goes all in on some significant features that are novel to the Apple smartphone ecosystem: an edge-to-edge OLED display, a TrueDepth front-facing camera system, removal of TouchID in favor of a new facial recognition system called FaceID, and a few new features surrounding the integrated neural engine inside the A11 SoC.

    The iPhone X (pronounced iPhone Ten) is a visually significant departure from previous Apple smartphones. The 5.8-inch display is called an ‘edge-to-edge’ display in the marketing material, citing minimal bezels and taking up pretty much the full real estate of the phone. Apple also dubs this as a new retina display, specifically a ‘Super Retina’ display, with a 2436x1125 resolution with a pixel density of 458 PPI. The display is Apple’s first foray into OLED technology on a smartphone, as ‘previous versions of OLED were not sufficient’ in previous generations. This means that Apple is promoting features such as HDR10 for high dynamic range, a 1000000:1 contrast ratio, and high color accuracy. That contrast ratio is due to the blacks provided by the OLED display, although it will be interesting to see what the practical limits are. Apple has always been consistent with having superb color accuracy on its smartphones, so we will have to see in our testing if OLED changes things in Apple’s qualification process. Also Apple’s TrueTone technology makes its way from the iPad to the iPhone. This display technology uses data from the ambient light sensor to detect the ambiance of the surroundings and adjust colors (particularly when reading black on white) and adjusting the display to make it easier to read. The display will also support 3D Touch.

    With Apple moving to a full-screen technology like this, there is no room for the standard Home button, and with it, TouchID. As a replacement/upgrade, Apple is implementing FaceID: a set of front-facing technologies that will develop a face-map of a user and embed that as the passcode. This functionality is likely derived from Apple’s acquisitions of PrimeSense in 2013 (the IP behind Microsoft Kinect) and FaceShift in 2015. Apple states that the technology uses its embedded neural network engine to speed up facial recognition, but also that algorithms are in place such that the system will work if a user puts on glasses, wears a hat, has different hair, and even in low light. The algorithms will also auto-update as a user grows a beard. A lot of security researchers have questioned this move, while Apple quotes that the possibility for a false positive on TouchID was around 50k-to-1, FaceID should be more similar to a million-to-one. With FaceID, users will be able to unlock the device, as well as use their face to preapprove ApplePay purchases before touching a pay pad.

    In order to enable FaceID, Apple implemented a small top area for the main hardware. This includes an infrared camera, a flood illuminator, the front camera, and a dot projector. The hardware will map the face in three dimensions with a 5-second startup (when in sufficient light) to produce a face mesh. One version of the mesh, with the textures as part of the algorithm, will be held in a secure enclave for identification and approval. At this point in time, only one face per device can be registered, marking an initial limitation in the hardware. One of the other features for the technology shown by Apple was the ability to generate a face mesh and map new textures to it, such as new SnapChat ‘masks’, or animated emoji in Message. The hardware will map 50 muscle tracking points, and a user can choose one of twelve animal emoji (fox, cat, dog, pig, unicorn, poop emoji) and record a ten second message where the ‘ani-moji’ will mimic in real-time how the user is moving and speaking in order to send to the other person. Apples plan here is to open the resources up to developers to use in their own applications.

    Because the FaceID hardware is essentially an indent into the display, there will be some issues on content that will have to be addressed. On the home screen, Apple has designed the top icons to be inside the two nooks either side of the FaceID hardware, and adjust as needed. As shown by several journalists on the show floor at the launch event, the video will naturally default to fit perfectly without the little nooks, but if a user selects full screen, it will wrap around the FaceID hardware and intrude into the video being watched. Apple usually prides itself in the simplicity in its display support, and this might be a little scratch in that armor.

    With no home button, Apple is having to implement new interactions to deal with regular home button actions. To wake the phone from a screen off state, a user can tap on the display (or use FaceID if setup). To get to the home screen, the user can swipe up in any application, although this seems a bit fraught with issues, especially with games where swiping up is a key mechanic of the application. In order to get the list of applications in memory, then swipe up but hold the finger down on the screen. Apple neglected to mention how to put the phone to sleep / screen off mode – there is a button on the side, but that is specifically for Siri. In order to get the notifications menu, swipe down from the top.

    Under the hood, Apple is using its new A11 Bionic processor, with significant upgrades over the A10 and A10X. Details were scarce, but this is a TSMC 10nm design featuring six cores: two high-performance cores and four power efficient cores, with all six cores available for use at the same time. Apple is quoting that the high-performance cores are 25% faster than the high-performance cores in A10, while the high-efficiency cores are 70% faster than their counterparts in A10. No speeds are details about the cores were provided, though some initial analysis online from the code base suggests that the larger cores have two levels of private cache, while the smaller cores only have one level of private cache, with a high level of shared cache between both sets before hitting the DRAM. The A11 SoC will come in at 4.3 billion transistors, and features Apple’s second generation performance controller to assist with the 2+4 configuration. Also involved is a new GPU, which Apple states is its own custom design, coming in at ‘three cores’ (whatever that means in this context) and offers 30% higher performance than the graphics in the A10. Apple also stated that it can offer A10 graphics for half the A10 power, and that the GPU can assist in machine learning. We’ve seen discussions on Apple’s Metal 2 compute already appear at WWDC, so this is likely what Apple is talking about. The SoC also features a new ‘Neural Engine’ inside, offering two cores and 600 Giga-Ops per second, although no information as to how this inference hardware operates or at what precision (for example, Huawei’s NPU gives 1.92 TFLOPs of FP16). Apple was very light on A11 details, so we’ll likely revisit this topic later with more details.

    For the camera system, Apple is using a vertical dual camera on the rear of the iPhone X, rather than the horizontal cameras on the iPhone 7 Plus and iPhone 8 Plus. Both of these cameras are new models, both are 12 megapixels, and both come with optical image stabilization. One camera is f/1.8, while the other is f/2.4, with both having larger and faster sensors with deeper pixels than previous iPhones to aid in image focus. Like with the iPhone 8 and iPhone 8 Plus, Apple will use the embedded Neural Engine to assist with photo taking, such as adjusting skin-tone mapping in real-time depending on the environment. The camera also supports dual Quad-LED flash.

    The full design is glass on the back and front, using a new technology that Apple is quoting as the most shatter-resistant glass on an iPhone, and the band in the device will be ‘surgical grade stainless steel’ rather than aluminum. The iPhone X will be dust and water resistant, although Apple stopped short of giving it a full IPXX rating. Due to the glass, Apple is equipping the iPhone X with wireless charging capabilities using the Qi standard, and will offer a large ‘Air Power’ pad in 2018 that will allow users to wireless charge the iPhone X, the new Apple Watch Series 3, and the Air Pods all at the same time. Apple did not go into the size of the battery, although it does quote it as having two hours more battery life than the iPhone 7, despite the large OLED display.

    Lots of features that we’ve seen discussed in previous Apple launches were glossed over here: changes in the haptic feedback, anything about audio (there’s no 3.5mm jack, if you were wondering), any hard performance metrics, SoC details about the cores and how/if they are different, or frequencies, or how the Neural Engine is laid out, or even how much DRAM is in the device. This is likely due to the fact that even for a two-hour presentation, time was spent detailing the new features more than the underlying hardware. Unlike other smartphone vendors or chip designers, Apple doesn’t do a deeper ‘Tech Day’ on their hardware, which is a shame.

    What we do know is that Apple will be offering two storage options, 64GB and 256GB, and two colors in Space Grey and Silver (both of which have a slight pearlescence, according to Apple). The 64GB model will start at $999, and include Ear Pods in the box. The 256 GB model will have some markup, although Apple did not disclose how much. The iPhone X will go up for pre-order on October 27th in around 30 countries, and ship on November 3rd.

    Additional: turns out there are a lot more specifications on Apple's product page that just went live. Key features are screen brightness (625 nits), dimensions (143.6 x 70.9 x 7.7 mm, 174 grams), native FLAC support and HDR video playback support. The 256 GB model will start at $1149, putting a $150 mark-up on the higher capacity, and the Lightning-to-3.5mm cables are still included in the box.

    Apple iPhone
      iPhone 7 iPhone 7 Plus iPhone 8 iPhone 8 Plus iPhone X
    SoC Apple A10 Fusion
    2 x 2.3 GHz Hurricane
    2 x little cores
    Apple A11 Bionic
    2 x High-Perf
    4 x High Efficiency
    GPU 6 Core PowerVR GPU 3-Core Apple Custom 
    Display 4.7-inch
    1334 x 750
    IPS LCD
    DCI-P3
    5.5-inch
    1920 x 1080
    IPS LCD
    DCI-P3
    4.7-inch
    1334 x 750
    IPS LCD
    DCI-P3
    5.5-inch
    1920 x 1080
    IPS LCD
    DCI-P3
    5.8-inch
    2436x1125
    OLED
    DCI-P3
    Size / Mass 138.3 x 67.1 x 7.1 mm
    138 grams
    158.2 x 77.9 x 7.3 mm
    188 grams
    138.4 x 67.3 x 7.3 mm
    148 grams
    158.4 x 78.1 x 7.5 mm
    202 grams
    143.6 x 70.9 x 7.7mm
    174 grams
    Battery 1960 mAh
    (7.55Whr)
    2900 mAh
    (11.17Whr)
    ? ? +2hr over iPhone 7
    Wireless Charging - - Qi Qi Qi
    Rear Cameras 12 MP f/1.8, OIS
    Wide Color Gamut
    Quad LED True Tone Flash
    12 MP, f/1.8, OIS
    Wide Color Gamut
    Quad LED True Tone Flash
    - 12MP ƒ/2.8 Telephoto,
    2x Optical
    Portrait Mode
    - 12 MP f/2.8
    Telephoto,
    2x Optical
    Portrait Mode,
    Portrait Lighting
    12 MP f/2.4 Telephoto, OIS
    2x Optical
    Portrait Mode,
    Portrait Lighting
    Front Camera 7MP ƒ/2.2
    Wide Gamut
    Retina Flash
    7MP ƒ/2.2
    Wide Gamut
    Retina Flash
    7MP f/2.2
    Wide Gamut
    Retina Flash
    Portrait Mode,
    Portrait Lighting
    Storage 32 / 128 / 256 GB 64 / 256 GB
    I/O Apple Lightning connector Apple Lightning connector
    WiFi 2.4 / 5GHz 2T2R 802.11a/b/g/n/ac, NFC
    BlueTooth 4.2
    2.4 / 5GHz 2T2R
    802.11a/b/g/n/ac, NFC

    BlueTooth 5.0
    Launch Price 32 GB: $649
    128 GB: $749
    256 GB: $849
    32 GB: $769
    128 GB: $869
    256 GB: $969
    64 GB: $699
    256 GB: $849
    64 GB: $799
    256 GB: $949
    64 GB: $999
    256 GB: $1149

     

     

  • Suite des tests de SSD PC dans nos Mac (MacBidouille)

    Gilles continue son travail de test considérable. Voici ses derniers retours.

    Je continue mes tests...

    voici encore une petite mise à jour concernant les SSD PCIe sur les Mac.

    Tout d'abord un rappel, pour les SSD AHCI PCIe (donc la majorité de ce qui se faisait jusqu'à présent) :

    - ceux d'Apple (MZ-JPU256T, MZ-JPU512T-A6 etc.) fonctionnent évidemment dans tous les Mac de 2013 à 2017

    Ils restent l'idéal voire la seule solution pour mettre à jour un MacBook Air ou Pro de 2013-2014,

    mais ils sont chers, et difficiles à trouver (ebay, Aliexpress) et n'existent pas en plus de 1 To.

    - ceux du monde PC, tels que le Lite-on LGT-512B1P, fonctionnent eux aussi dans tous les Mac de 2013 à 2017

    avec l'adaptateur M.2 vers Apple 12+16

    Ceci dit ces SSD PCIe en AHCI sont très durs à trouver car plus fabriqués neufs...

    Il y a en plus un problème de réveil à la mise en veille sur les MacBook Pro de 2014 et plus récents

    Pour les SSD Apple NVMe comme le Apple SSD SM2024L qu'on trouve dans les iMacs 2017 ou le 24GB Fusion drive dans les iMacs 21" 2015.

    Ces SSD ne se trouvent pas facilement dans le commerce (pièces SAV Apple) mais fonctionnent vraiment parfaitement.

    Les tests que j'ai faits indiquent que :

    - Mac Pro late 2013 : non bootable (fonctionne si booté sur HD externe en 10.13)

    - MacBook Pro 13" et 15" Late 2013 : non bootable (fonctionne si booté sur HD externe en 10.13)

    - MacBook Air early 2014 : non bootable (fonctionne si booté sur HD externe en 10.13)

    - MacBook Pro 13" et 15" Mid 2014 : non bootable (fonctionne si booté sur HD externe en 10.13)

    - Macmini Late 2014 : fonctionne (en 2x lanes PCIe 2.0) et bootable

    - MacBook Air early 2015 : fonctionne (en 2x lanes PCIe 2.0) et bootable

    - MacBook Pro 13" early 2015 : fonctionne (en 4x lanes PCIe 3.0) et bootable

    - MacBook Pro 15" Mid 2015 : fonctionne (en 4x lanes PCIe 3.0) et bootable

    Quant aux SSD non-Apple NVMe, (Samsung SM961, Samsung 960 Evo, Samsung 960 Pro, Western Digital M.2)

    Ces SSD se trouvent facilement dans le commerce (960 Evo et Pro notamment) et existent jusqu'à 2 To !

    A noter qu'ils n'ont pas leur sonde de température reconnue

    il faut donc faire attention avec leur température en installant, par exemple, MacFans control.

    les tests indiquent :

    - Mac Pro late 2013 :non bootable (fonctionne si booté sur HD externe en 10.13)

    - MacBook Pro 13" et 15" Late 2013 : non bootable (fonctionne si booté sur HD externe en 10.13)

    - MacBook Air early 2014 : non bootable (fonctionne si booté sur HD externe en 10.13)

    - MacBook Pro 13" et 15" Mid 2014 : non bootable (fonctionne si booté sur HD externe en 10.13)

    - Macmini Late 2014 : fonctionne (en 2x lanes PCIe 2.0) et bootable

    - MacBook Air early 2015 : fonctionne (en 2x lanes PCIe 2.0) et bootable

    - MacBook Pro 13" early 2015 : ecran noir - problème de reconnaissance aléatoire (bus PCIe 3.0 ?)

    - MacBook Pro 15" Mid 2015 : ecran noir - problème de reconnaissance aléatoire (bus PCIe 3.0 ?)

    Voilà.

    il me reste à tester les iMacs mais pour ces machines, l'intérêt est très limité vu que tous les iMacs ont au moins un emplacement 2,5" ou 3,5" et donc peuvent accueillir des SSD SATA un peu moins performants, mais surtout beaucoup moins chers...

  • Firefox en version 72. Quoi de neuf ? (Génération NT: logiciels)
    La version 72 de Firefox bloque par défaut les scripts de fingerprinting. Elle réduit la nuisance des demandes de notification des sites et rend disponible le Picture-in-Picture sur macOS et Linux.
  • Raja Koduri, Head of AMD's RTG, to go on Sabbatical until December (AnandTech)

    Late last night, PC Perspective confirmed rumors that Raja Koduri, AMD's Radeon Technologies Group (RTG) Senior Vice President and Chief Architect, is to go on sabbatical. Sourcing Raja’s internal letter to the RTG team, he will be taking leave from September 25 until an unspecified date in December, to spend time with his family. Dr Lisa Su, AMD's CEO, will lead RTG in the interim.

    As reproduced by Ryan Shrout, Raja’s letter is as follows:

    RTG Team,

    You haven’t heard from me collectively in a while – a symptom not only of the whirlwind of launching Vega, but simply of the huge number of demands on my time since the formation of RTG. Looking back over this short period, it is an impressive view. We have delivered 6 straight quarters of double-digit growth in graphics, culminating in the launch of Vega and being back in high-performance. What we have done with Vega is unparalleled. We entered the high-end gaming, professional workstation and machine intelligence markets with Vega in a very short period of time. The demand for Vega (and Polaris!) is fantastic, and overall momentum for our graphics is strong.

    Incredibly, we as AMD also managed to spectacularly re-enter the high-performance CPU segments this year. We are all exceptionally proud of Ryzen, Epyc and Threadripper. The computing world is not the same anymore and the whole world is cheering for AMD. Congratulations and thanks to those of you in RTG who helped see these products through. The market for high-performance computing is on an explosive growth trajectory driven by machine intelligence, visual cloud, blockchain and other exciting new workloads. Our vision of immersive and instinctive computing is within grasp. As we enter 2018, I will be shifting my focus more toward architecting and realizing this vision and rebalancing my operational responsibilities.

    At the beginning of the year I warned that Vega would be hard. At the time, some folks didn’t believe me. Now many of you understand what I said. Vega was indeed hard on many, and my sincere heartfelt thanks to all of you who endured the Vega journey with me. Vega was personally hard on me as well and I used up a lot of family credits during this journey. I have decided to take a time-off in Q4 to spend time with my family. I have been contemplating this for a while now and there was never a good time to do this. Lisa and I agreed that Q4 is better than 2018, before the next wave of product excitement. Lisa will be acting as the leader of RTG during by absence. My sincere thanks to Lisa and rest of AET for supporting me in this decision and agreeing to take on additional workload during my absence.

    I am looking to start my time-off on Sept 25th and return in December.

    Thank you, all of you, for your unwavering focus, dedication and support over these past months, and for helping us to build something incredible. We are not done yet, and keep the momentum going!

    Regards, Raja

    Since his return to AMD in 2013 and the reformation of a monolithic graphics division with RTG in 2015, Raja has overseen and led all aspects of AMD graphics hardware and software. Raja’s public presence and involvement render him the face of graphics at AMD, in all senses of the word, from Capsaicin events to Twitter and Reddit. Following Vega’s launch, Raja had taken two weeks vacation to visit family, following visits to company sites in India.

    Given the news in his letter, we hope all is well.

  • Google Chrome : un bouton de contrôle multimédia intégré (Génération NT: logiciels)
    Le navigateur Google Chrome a droit à un bouton dédié pour le contrôle multimédia. Son déploiement avait été annoncé pour la version stable actuelle. Il est possible de le retrouver si besoin dans les flags.
  • Running Cyrus IMAP (BSD DevCenter)
    tile imageAs laptops and mobility become more effective and prevalent, your job as a system administrator is to provide users with easy, secure access to their data. IMAP is one way to allow users to receive email wherever they go. Cyrus IMAP is a popular server, but installation and configuration is a bear. Fortunately, Francisco Reyes has the answer in this tutorial on installing and configuring Cyrus IMAP with Postfix.
  • Samsung lancera ses premiers téléviseurs MicroLED à la fin de l'année (MacBidouille)

    Après l'OLED, la prochaine étape est le MicroLED. Cette technologie est similaire à l'OLED avec des pixels indépendants et capables de s'illuminer, mais utilise des composants métalliques à la place des organiques, de quoi gagner grandement en durée de vie et éviter que les écrans ne marquent.
    On sait qu'Apple s'intéresse grandement à cette technologie depuis son rachat de LuxVue en 2014. Elle travaillerait activement avec des partenaires pour la proposer sur les produits en commençant par l'Apple Watch.

    Samsung, leader dans l'OLED, ne veut certainement pas laisser à quiconque l'occasion de lui passer devant. Elle a annoncé qu'elle proposera ses premiers téléviseurs MicroLED d'ici la fin de l'année. Elle fabriquera à ce moment-là des dalles de toutes tailles pour tous les usages.

    Samsung attend beaucoup de cette technologie qui créera des micro-points RVB pour reconstituer une image avec un meilleur angle de vision que l'OLED.

  • Apple craint les conséquences des taxations américaines sur les importations chinoises (MacBidouille)

    Apple craint de plus en plus les conséquences des taxations américaines à venir sur les produits importés de Chine. Dans une lettre, elle explique que ces taxes vont avoir une forte incidence sur les prix de vente de ses produits : Mac, iPhone, iPad, AirPods... Il en sera de même sur des composants SAV comme les batteries ou encore les accessoires comme les claviers et les souris.
    Cela aura un impact sur ses ventes, ses bénéfices et ses capacités d'investissement.

    La société joue clairement sa dernière carte pour tenter de faire plier la présidence américaine, utiliser son capital sympathie pour faire pencher l'opinion de son côté.
    Il faut dire qu'étant donné le prix très élevé de ses appareils, une augmentation de prix pouvant atteindre 25% serait catastrophique.

  • Windows 10 : la grande majorité choisit la totale en télémétrie (Génération NT: logiciels)
    La confiance en Windows 10 est rétablie ? Les utilisateurs seraient en tout cas satisfaits des modifications apportées pour le contrôle de la confidentialité. À pondérer.
  • L'iPhone 8 est actuellement le smartphone le plus vendu (MacBidouille)

    Counterpoint a publié sa dernière estimation des ventes de smartphones.

    L'iPhone 8 est en tête juste devant le Galaxy S9 plus. En troisième position on a l'iphone X.

    A quelques mois du renouvellement de gamme, il n'est pas surprenant que les personnes devant changer d'appareil s'orientent vers un modèle moins coûteux dans la gamme Apple.

  • Le nouvel iPad bon marché est très semblable au premier iPad Air à l'intérieur (MacBidouille)

    iFixit a démonté le nouvel iPad bon marché.

    A très peu de détails près, comme un module Wi-fi plus petit ou l'intégration du TouchID, il est très semblable à l'intérieur au premier iPad air.

    La dernière image montre combien Apple a réussi à pousser l'intégration de sa tablette, jusqu'à réduire à un nombre incroyablement faible le nombre de choses à assembler pour le produire.

  • Office 365 gratuit pour les associations et organismes à but non lucratif (Génération NT: logiciels)
    Microsoft annonce Office 365 for Nonprofits. Les associations et organismes à but non lucratif vont pouvoir s'abonner à Office 365 gratuitement ou à prix réduit.
  • HP Updates Z8 Workstations: Up to 56 Cores, 3 TB RAM, 9 PCIe Slots, 1700W (AnandTech)

    HP has updated its most powerful dual-processor Z8 workstation line with the latest components. The new systems contain up to two Intel Skylake-SP Xeon CPUs with up to 56 cores in total, up to 3 TB of DDR4 RAM, terabytes of storage as well as up to 9 PCIe slots along with optional TB3 and 10 GbE support via add-in cards. The HP Z8 workstation will be the pinnacle of HP’s computers for personal and professional use and its price in high-end configurations will surpass even the top-of-the-range gaming PCs.

    Historically, most high-end workstations relied on server platforms to support more than one CPU and thus offer higher performance than any consumer desktop. The emergence of dual-core and then multi-core CPUs a little more a decade ago changed the workstation market quite quickly and significantly. In a world with quad-core CPUs, 4-way workstations did not make a lot of sense for 99% of the users and therefore they quickly became extinct. Moreover, by now, even 2-way workstations became rare. Today, the vast majority of workstations use one multi-core CPU that provides enough compute horsepower for professional workloads, whereas GPU-based accelerators are used for tasks like simulations. Nonetheless, there are still users who need maximum x86 performance and who therefore require 2-way workstations — and the HP Z8 is aimed precisely at such users. While the Intel Xeon Scalable processors with extreme core count were developed primarily with servers in mind, the Z8 is a system that people put on their desks and therefore it has a number of specific requirements regarding noise levels, features, security, compatibility with components and so on.

    One of the key components of all PCs is its microprocessor. When it comes to the HP Z8, it is based on up to two Intel Xeon Platinum 8180 with 28 cores and 205 W TDP each, which means that the system has to remove 410 W of thermal energy only from CPUs, and this requirement had a significant impact on the design of the whole system. The company did not want to use a liquid cooling system, so it had to design an air cooling solution capable of cooling down two extremely hot CPUs as well as up to 24 DDR4-2666 memory modules. Each processor has its own radiator equipped with a high-pressure air fan (which speed is regulated by BIOS in accordance with system temperature monitored by numerous sensors). In addition, the system has multiple airflow vents on the front and on the top as well as one fan that exhausts hot air on the back. According to HP, such a chassis architecture ensures that the second CPU does not re-use warm air from the first one, but since they are located in close proximity, one will always affect another with its heat. Finally, the system has additional fans that cool down other components and produce more airflow within the chassis.

    Speaking of other components, the HP Z8 supports plenty of them — whatever one might want. First off, the system has four PCIe 3.0 x16 slots for graphics cards or SSDs (up to AMD Radeon Pro, NVIDIA Quadro P100 or GP100, up to 4 TB HP Z Turbo Drive Quad Pro, etc.) three PCIe 3.0 x8 (two are non-hot swap) slots for SSDs and two PCIe 3.0 x4 slots. In addition to PCIe-based storage, the Z8 also features four 2.5”/3.5” bays for SATA/SAS SSDs or HDDs as well as two external 5.25” bays that can also accommodate drive form-factor storage devices using appropriate adapters. Those who need it, HP may also install an SD card reader as well as a slim DVD or Blu-ray ODD.

    When it comes to connectivity, the HP Z8 has all the bases covered. By default, the system supports two GbE connectors (powered by Intel controllers), an 802.11ac Wi-Fi + Bluetooth module (Intel Wireless-AC 8265 controller), two USB 3.1 Type-C ports and two USB 3.1 Type-A ports on the front, four USB 3.1 Type-A ports on the back, multi-channel audio connectors (a Realtek HD ALC221 controller) on the back, a TRRS audio connector on the front and so on. Meanwhile, owners can optionally order to install two 10 GbE controllers, a Thunderbolt 3-supporting add-in-card and a variety of custom components for various industries and workloads (an external audio solution for a 5.25” bay, for example).

    Since many businesses and enterprises require robust security for all of their machines, the HP takes everything seriously and ships the Z8 with a whole set of security features that it calls HP SureStart. The system features secure authentication, full volume encryption, TPM 2.0, has a Kensington lock and so on.

    All the CPUs, GPUs, SSDs and other components require a lot of power and HP Z8 has plenty of it. The manufacturer offers 1125 W, 1450 W or 1700 W internal PSUs with up to 90 % efficiency. The PSU is located in a compartment behind the motherboard, so chances are that HP uses proprietary units.

    General Specifications of the HP Z8 2017
      HP Z8 G4
    CPU Family Intel Xeon Scalable processor
    Models Xeon Platinum 8180 (2.5GHz/3.8GHz, 38.5MB cache, 28 cores)
    Xeon Platinum 8160 (2.1 GHz/3.7 GHz, 33 MB cache, 24 cores)
    Xeon Gold 6152 (2.1 GHz/3.7 GHz, 30.25 MB cache, 22 cores)
    Xeon Gold 6154 (3 GHz/3.7 GHz, 24.75 MB cache, 18 cores)
    Xeon Gold 6148 (2.4 GHz/3.7 GHz, 27.5 MB cache, 20 cores)
    Xeon Gold 6142 (2.6 GHz/3.7 GHz, 22 MB cache, 16 cores)
    Xeon Gold 6136 (3 GHz/3.7 GHz, 24.75 MB cache, 12 cores)
    Xeon Gold 6140 (2.3 GHz/3.7 GHz, 24.75 MB cache, 18 cores)
    Xeon Gold 6134 (3.2 GHz/3.7 GHz, 24.75 MB cache, 8 cores)
    Xeon Gold 6132 (2.6 GHz/3.7 GHz, 19.25 MB cache, 14 cores)
    Xeon Gold 6130 (2.1 GHz/3.7 GHz, 22 MB cache, 16 cores)
    Xeon Gold 6128 (3.4 GHz/3.7 GHz, 19.25 MB cache, 6 cores)
    Xeon Gold 5120 (2.2 GHz/3.2 GHz, 19.25 MB cache, 14 cores)
    Xeon Gold 5118 (2.3 GHz/3.2 GHz, 16.5 MB cache, 12 cores)
    Xeon Gold 5122 (3.6 GHz/3.7 GHz, 16.5 MB cache, 4 cores)
    Xeon Silver 4116 (2.1 GHz/3 GHz, 16.5 MB cache, 12 cores)
    Xeon Silver 4114 (2.2 GHz/3 GHz, 13.75 MB cache, 10 cores)
    Xeon Silver 4112 (2.6 GHz/3 GHz, 8.25 MB cache, 4 cores)
    Xeon Silver 4108 (1.8 GHz/3 GHz, 11 MB cache, 8 cores)
    Xeon Bronze 3106 (1.7 GHz, 11 MB cache, 8 cores)
    Xeon Bronze 3104 (1.7 GHz, 8.25 MB cache, 6 cores)
    Graphics Entry NVIDIA Quadro P400 (2 GB GDDR5)
    NVIDIA Quadro P600 (2 GB GDDR5)
    AMD FirePro W2100 (2 GB DDR3)
    Mid-Range NVIDIA Quadro P1000 (4 GB GDDR5)
    NVIDIA Quadro P2000 (5 GB GDDR5)
    AMD Radeon Pro WX 3100 (4 GB GDDR5)
    AMD Radeon Pro WX 4100 (4 GB GDDR5)
    High-End NVIDIA Quadro P4000 (8 GB GDDR5)
    AMD Radeon Pro WX 7100 Graphics (8 GB GDDR5)
    Ultra High-End NVIDIA Quadro P5000 (16 GB GDDR5X)
    NVIDIA Quadro P6000 (24 GB GDDR5X)
    AMD Radeon Pro WX 9100 Graphics (16 GB HBM2)
    NVIDIA Quadro GP100 (16 GB HBM2)
    RAM 24 DDR4 DIMMs, up to 1.5 TB of DDR4-2666
    (3TB options in H1 2018, when M CPUs are available)
    Storage Bays 4 × 2.5"/3.5", 2 × 5.25", 1 × slim 5.25" for ODDs
    Options 300 GB SAS (15000 rpm)
    500 GB up to 2 TB SATA (7200 rpm)
    500 GB SATA SED (7200 rpm)
    1 TB up to 4 TB 7200 rpm SATA Enterprise
    256 GB up to 2 TB SATA SSD
    256 GB up to 512 GB SATA SED Opal 2 SSD
    240 GB up to 480 GB SATA Enterprise SSD
    256 GB up to 1 TB HP Z Turbo Drive PCIe SSD M.2
    256 GB up to 512 GB HP Z Turbo Drive PCIe SED SSD M.2
    256 GB up to 4 TB HP Z Turbo Drive Quad Pro PCIe SSD
    HP Slim DVD-ROM
    HP Slim Blu-ray Writer
    HP Slim DVD-Writer
    Networking GbE Integrated Intel I219-LM PCIe GbE
    Integrated Intel X722 PCIe GbE
    Intel I350-T2 dual-port GbE NIC
    Intel I350-T4 dual-port GbE NIC
    Intel I210-T1 PCIe GbE
    10 GbE Intel X550-T2 dual-port GbE NIC
    Intel X710-DA2 dual-port GbE NIC
    Intel 10 GbE SFP+ SR transceiver
    HP dual-port 10GBase-T NIC
    Wireless Intel Dual Band Wireless-AC 8265 802.11a/b/g/n/ac (2x2) Wi-Fi and Bluetooth 4.2 Combo, non-vPro
    PCIe 3.0
    Expansion Slots
    x4 2
    x8 3
    x16 4
    Notes 1 PCIe x8 has rear bulkhead access and 2 PCIe x8 are internal access only. Slot 1: Transforms to PCIe x8 when 2nd CPU is installed.
    Slots 3 and 6: are available only when 2nd processor is installed.
    PCIe x16 - Available only when 2nd processor is installed
    USB 3.1 2 × Type-A, 2 × Type-C
    3.0 4 × Type-A
    2.0 unknown
    Thunderbolt Optional Thunderbolt 3 add-in-card
    Card Reader 4-in-1 card reader
    PSUs 1125 W, 1450 W, 1700 W
    Other I/O Audio connectors, Realtek HD ALC221 controller
    Input Devices HP Wireless Business Slim Keyboard and Mouse Combo
    HP USB Business Slim Keyboard
    USB Premium wired keyboard
    USB Smart Card (CCID) keyboard
    3Dconnexion CADMouse
    HP USB Optical Mouse
    HP PS/2 Mouse
    HP USB Hardened Mouse
    Dimensions 8.5 × 21.7 × 17.5 in
    21.59 × 55.12 × 44.45 cm
    Weight Starting at 49.4 lb
    Starting at 22.4 kg
    Operating System Windows 10 Pro for Workstations
    HP Installer Kit for Linux
    HP Red Hat Enterprise Linux
    Price Starting at $2,439

    Now, time to talk about availability and pricing. HP intends to ship the HP Z8 workstations in October. An entry-level model with one CPU, a basic GPU and storage will cost $2,439. Meanwhile, once the system is equipped with two Xeon Platinum 8180 CPUs, NVIDIA Quadro P100/GP100 graphics, multiple PCIe SSDs, 3 TB of DDR4 memory, several 12 TB HDDs and various advanced I/O capabilities (TB3, 10 GbE, etc.), its price will easily hit tens of thousands of dollars.

    It's normally at this point that a vendor such as HP states that the high-end models are likely to be sold under B2B contracts, where per-unit costs are not as severe. One OEM has told us that only 5% of sales of their high-end workstations come through direct sales for onlike pricing.

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  • Dell’s Visor Available for Pre-Order: A Mixed Reality Headset, Ships in Mid-October (AnandTech)

    Dell has begun to take pre-orders on its Visor headset for Windows Mixed Reality applications. The company will start shipments of the device in mid-October, just in time for Microsoft’s Windows 10 Creators Update that arrives on October 17 and ahead of the holiday season.

    Starting from September 14, Dell’s Visor WMR headset is available for pre-order from Dell.com/Visor in the U.S. and from PCWorld in the U.K. The headset itself is priced at $349.99, the controller kit costs $99.99 and a Visor with controllers is priced at $449.99. In the U.K., the whole kit is available for pre-order at £429.99. In order to play non-controller based AR/VR games on the Visor, users will also have to get an Xbox One controller. Dell will start to ship its Visor product on October 17, 2017. In addition, the company plans to make the device available in BestBuy stores and directly from Microsoft (online and offline).

    Dell’s Visor AR/VR headset complies with Microsoft’s requirements for headsets compatible with the Windows Mixed Reality platform: it connects to Windows 10-based PCs using HDMI and USB cables, it features two 1440×1440@90 Hz LCD panels (for a total resolution of 2880×1440) and two cameras to capture the outside world. While ergonomics and industrial designs of WMR-compliant headsets from Dell, Acer, ASUS and Lenovo are different, internally they end up being very similar.

    The shipments date of the Dell Visor coincides with the launch date of Microsoft’s Windows 10 Creators Update, which will bring support for Windows Mixed Reality headsets to end users. That said it is highly likely that other makers of WMR gear will try to ship their products around the time of the official launch of the platform. In the meantime, Dell seems to be the first with pre-orders.

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  • Et si le prochain vecteur de croissance d'Apple était de ne plus rien vendre ? (MacBidouille)

    Dans le courant de la semaine nous avons lu une analyse "boursière" sur l'avenir d'Apple. Elle s'interrogeait sur la manière dont la société pourrait sur le long terme s'assurer encore de la croissance. La réponse était simple, ne plus rien vendre. Il s'agirait en fait de proposer aux clients non plus de leur vendre des produits toujours plus coûteux, mais de seulement les leur louer.
    La société a déjà commencé à le faire aux Etats-Unis pour les iPhone. Il est possible de les payer tout en s'assurant à la sortie d'un nouveau modèle de pouvoir rendre celui en sa possession et d'avoir le dernier modèle pour un paiement mensuel.
    L'idée peut surprendre ou en rebuter certains mais c'est déjà la manière dont on fonctionne avec Apple Music par exemple.
    Elle a le mérite de masquer le coût réel du produit derrière un abonnement mensuel qui passe mieux et la promesse alléchante de pouvoir toujours détenir ce qu'Apple fait de mieux est tentante.
    Accessoirement, cela règle le problème de pannes et de SAV, l'appareil étant réparé ou échangé gratuitement pendant la durée de la location.

    Ce genre de système existe depuis fort longtemps dans le monde automobile que ce soit sous forme de LOA ou de LLD. Les produits Apple étant de plus en plus chers, il devrait pouvoir finir par s'y imposer.

    Il faudra seulement faire attention à certaine choses, comme prendre une assurance spécifique pour les produits loués. En effet, en cas de vol ou de destruction, il faudra autrement les payer intégralement pour mettre fin à ce contrat.

  • Windows 10 : une autre mise à jour poids plume à l'automne prochain ? (Génération NT: logiciels)
    La version de Windows 10 au nom de code 20H2 va-t-elle prendre le même chemin que la November 2019 Update ? Une possibilité qui n'est pas à écarter.
  • Toshiba Weds 3D NAND and TSV: Up to 1 TB 3D TLC Chips with 1066 MT/s I/O Incoming (AnandTech)

    Toshiba on Wednesday introduced its first BiCS 3D TLC NAND flash chips with 512 GB and 1 TB capacities. . The new ICs stack 8 or 16 3D NAND devices using through silicon vias (TSVs) and are currently among the highest capacity non-volatile memory stacks available in the industry. Commercial products powered by the 512 GB and 1 TB packages are expected to hit the market in 2018, with an initial market focus on high-end enterprise SSDs

    Stacking NAND devices to build high capacity flash memory ICs has been used for years to maximize the capacities and performance of SSDs and other solid state storage devices. In many cases, NAND makers use wire-bonding technique to stack multiple memory devices, but it makes packages larger and requires a lot of power for reliable operation. However in more recent years, Toshiba has adopted TSV techniques previously used for ASIC and DRAM devices to stack its NAND ICs, which has enabled it to shrink size of its NAND packages and reduce their power consumption.

    TSVs are essentially electrodes that penetrate the entire thickness of a silicon die and connect the dies above and below it in the stack. A bus formed by TSVs can operate at a high data transfer rate, consume less power, and take up less space than a bus made using physical wires. Since 3D NAND is based on vertically stacked memory layers and has numerous vertical interconnects, so far Toshiba has not used TSVs to interconnect such devices. To wed TSV and 3D NAND, Toshiba had to develop a special 512 Gb BiCS NAND die featuring appropriate electrical conductors.

    It is noteworthy that the company used its 48-layer 2nd generation BiCS architecture instead of the 64-layer 3rd gen BiCS to design the 512 Gb 3D TLC NAND device. The reasons for such design decision are not obvious. On the one hand, 48-layers could minimize the height of the 8-high and 16-high stacks. On the other hand, Toshiba could opt for a lower number of layers because it is using a thicker process technology to build the 3D TLC NAND devices in a bid to improve their endurance (thus, a structure with fewer layers is meant to keep height in check).

    Toshiba’s 512 GB and 1 TB 3D TLC NAND ICs use a 1066 MT/s Toggle DDR interface, which is one of the advantages that the use of TSVs has enabled. Another advantage enabled by TSVs is a near doubling of Toshiba's data transfer energy efficiency relative to their existing BiCS2-based products that use wire bonding, according to the manufacturer.

    Toshiba's 512 GB and 1 TB 3D TLC NAND Chips
      512 GB (4096 Gb) 1 TB (8192 Gb)
    Package NAND Dual x8 BGA-152
    Base Die 512 Gb 48-Layer BiCS2 3D TLC NAND IC
    Number of Stacks 8 16
    External Dimensions Width 14 mm
    Depth 18 mm
    Height 1.35 mm 1.85 mm
    Interface Toggle DDR
    Inteface Data Transfer Rate 1066 MT/s

    The 512 GB and 1 TB 3D TLC NAND chips from Toshiba come in 14×18 mm packages and use the industry-standard dual x8 BGA-152 interface. The standard pinout is important because the ICs will be used primarily for high capacity SSDs used in servers. In fact, apart from their high density, the 1066 MT/s interface and overall energy efficiency will be the two significant benefits for datacenter-class drives. Further down the line, 512 GB and 1 TB 3D TLC NAND chips will also enable Toshiba and its partners to build 2.5" SSDs with 15 – 30 TB of usable capacity (Samsung uses 512 GB packages to build its flagship PM1633a) and go even higher with 3.5" drives.

    Toshiba has already started to ship prototypes of its 512 GB and 1 TB 3D TLC NAND chips for development purposes, and plans to start sampling the 8-high and 16-high flash memory ICs in the second half of 2017. It is hard to make precise predictions about the availability of actual SSDs based on the aforementioned chips, but it is logical to expect them in 2018.

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  • OpenBSD 3.8: Hackers of the Lost RAID (BSD DevCenter)
    tile imageEvery six months, the OpenBSD team releases a new version of their OS. It's time for OpenBSD 3.8. Federico Biancuzzi recently interviewed the core developers about new features and improvements, as well as ongoing struggles to find support from hardware vendors. Here's what to expect when you upgrade.
  • Logitech Acquires ASTRO Gaming, Strengthens Portfolio of Headsets for Consoles (AnandTech)

    In a bid to expand its portfolio of products, Logitech this week acquired ASTRO Gaming, whom is primarily known for its high-end headsets for consoles and PCs. The move will help Logitech to address the console gaming market with high-margin products and strengthen its headset lineup in general.

    Logitech’s family of products includes tens of mice and keyboards, many of which are designed for gamers with different requirements and budgets. But when it comes to headsets, Logitech (only) offers eight models priced from $35 to $200. By acquiring ASTRO Gaming, the company gets a portfolio of headsets that includes dozens of SKUs with different accessories and designs, many of which retail for $200 – $300, thus expanding Logitech’s addressable market. For the Lausanne-based company it is particularly important that ASTRO’s products are tailored for game consoles and come with special MixAmp controllers for quick setup and adjustments. Besides headsets, special edition headsets, and accessories for them, ASTRO Gaming sells various accessories for gamers, including headset cases, bags, hats, jackets, and other items.

    While ASTRO has loads of product SKUs, there is a catch: ASTRO Gaming only has three base headset models (if previous-generation devices are not taken into account), which they mix and match with different designs and accessories to create a wide product portfolio to address different customers. This is a typical approach of small companies that do not have huge R&D budgets to expand their lineups. Moreover, at present, ASTRO Gaming’s products are only available in the U.S. As a result of the acquisition, ASTRO gains access to Logitech’s technologies and global distribution, enabling further growth for the brand.

    Logitech is set to pay $85 million in cash for ASTRO Gaming and expects to close the deal next month. This is not the first time in the recent quarters where Logitech has expanded their products portfolio by acquiring other companies. In September 2016, the company acquired the Saitek brand and product lines, allowing them to enter the market for sim controllers. Just like in case of Saitek, ASTRO Gaming’s customers tend to be loyal and do not change their peripherals suppliers often.

    Meanwhile, given long upgrade cycles in the world of peripherals, it is not always easy to take advantage of customers’ loyalty. Instead, the more immediate play for Logitech will be to start capitalizing on ASTRO’s products by simply making them available in Asia and Europe.

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  • AMD Announces Carrizo and Carrizo-L, Next Gen APUs for H1 2015 (AnandTech)

    Today AMD is announcing the long anticipated upgrade to Kaveri, codenamed Carrizo. Carrizo is the natural successor to Kaveri, featuring x86 ‘Excavator’ cores alongside a Radeon-class GPU and promising an increase in performance all around.  The second part of today’s announcement is for Carrizo-L, an SoC pairing “Puma+” (upgraded Beema) cores also with AMD’s R-series GCN GPUs and a FCH into a single package.  Both Carrizo and Carrizo-L will feature ARM Trustzone, giving potential hardware-based built-in security when used by developers.

    The Excavator cores are an architectural improvement over Steamroller, but are fundamentally based on the original Bulldozer concept. Excavator will be AMD’s fourth iteration of the concept, following Bulldozer, Piledriver and Steamroller. This new generation of APUs are still set to be built on the 28nm Super High Performance process at Global Foundries, delaying AMD’s shift to 20nm, but AMD are still claiming that the new GPU in Carrizo is their best yet, giving better performance and efficiency than before.

    Given AMD's discrete GPU lineup, the GPU for Carrizo could be based on AMD's latest GCN 1.2 architecture, which was first introduced in the desktop Tonga part earlier this year. GCN 1.2's lossless delta color compression algorithms help improve the performance in memory bandwidth limited scenarios, such as in APUs. This could result in a bigger-than-expected jump in performance, although we will wait until we can test to find out how much it helps.

    The Carrizo platform will be fully HSA 1.0 compliant, compared to Kaveri which only had ‘HSA Features’, as AMD puts it in their latest mobility roadmap update:

    The push from AMD into HSA compliant APUs was well documented back at the launch of Kaveri earlier this year. This enabled the CPU and GPU components of the silicon, while under OpenCL 2.0 mode, to have access to the main block of system DRAM with zero-time copy functions, offering the potential for large classes of applications especially those in the prosumer and industry space to be accelerated by having instant access to the parallelization afforded by the GCN GPU. One of the big drawbacks of being an earlier adopter to HSA, as we noted at the time, was that software developers required time to bring their code to market, as well as AMD having to go out and teach the developers how to cater for HSA topology.

    Both Carrizo and Carrizo-L on the mobile side will be targeted at the same power bands as Kaveri and Beema, although the socket will be new. The use of FP4 BGA also indicates that a single socket will cater for both the Excavator and Puma+ based APUs and would be interchangeable. A video by AMD’s VP/GM for Computing and Graphics, John Byrne, states that Carrizo and Carrizo-L are currently being tested internally ready for a 1H 2015 release, along with support for DirectX 12, OpenCL 2.0, Mantle and Freesync.

    One of the big features that AMD is pushing with Carrizo is energy efficiency, with it being a keystone of the message. Because AMD have been on the same process node for a short while, they have to essentially follow the Maxwell example, by providing more performance for less power without the advantage of shrinking resistors. We were provided with an energy efficiency roadmap as well, showing the different methods AMD is using to achieve this:

    One example of the efficiency improvement was provided by AMD’s Voltage Adaptive Operation. Rather than compensate for voltage variations which wastes energy, this technology takes the average operating voltage and detects when the voltage increases beyond a smaller margin. To compensate for this increase, the CPU speed is reduced until the voltage drops below the threshold and then the CPU speed is moved back up.

    The changes in speed are designed to be so minute that it does not affect overall performance, however it might only take an errant voltage delivery component to consistently make the voltage go above that threshold, causing erratic slowdown that might be statistically significant. It will be interesting to see how AMD implements the latest version of this feature.

    The 2015 desktop roadmap remains unpublished so far. AMD’s perception of a mobile-focused strategy would tend to suggest that the mobile comes first, with desktop following behind, although at this point it is unclear. A number of AMD’s marketing materials with this launch gave examples of the use of Carrizo and HSA for the prosumer, indicating that a desktop version should be announced in due course.

    As of yet there was no discussion on the APUs to be launched, the speeds or the capabilities. All the roadmap tells us is 'up to four cores' (Excavator for Carrizo, Puma+ for Carrizo-L), some GCN compute units and 10-45W overall. There is no mention of DDR4 support, although the timeframe might be relevant for AMD to make the jump. Given the launch is still at least two quarters away, I would expect better details in due course. That timeframe fits in nicely around or just after Computex, perhaps indicating more details then.

    Source: AMD

  • Microsoft Shows Off Continuum For Windows 10 Phones (AnandTech)

    Today Microsoft revealed a number of new features relating to their various platforms at their BUILD developer conference. One of the most interesting features shown was the Continuum feature of Windows 10 phones. Microsoft has previously shown off the ability for tablets to connect to larger screens and input peripherals to act as a computer, and they have now shown those same abilities working on a smartphone. This is possible because applications developed for Windows 10 will be universal applications that can scale from your phone, to your computer, to your television.

    During the keynote a Windows 10 smartphone was shown connected to a large display via HDMI, as well as to a Bluetooth keyboard and mouse. This allowed the phone to essentially act as though it were a Windows 10 computer, with applications like PowerPoint and Excel scaling to use the same layout that you would see when running them on a normal desktop computer. This type of dynamic behavior extends from interface changes to input paradigm changes as well. Devices may change their preferred input mode or interface to suit the peripherals that are or are not attached to a device.

    Continuum looks like it will be a very interesting feature. Users will have to wait some time to get their hands on it though, as it won't be available in the preview release of Windows 10 that is scheduled to come out tomorrow. Microsoft has created a short video to explain a bit more about Continuum on Windows 10 phones and the potential use cases that they see for it, and I've embedded that video above.

  • Network Filtering by Operating System (BSD DevCenter)
    tile imageSome operating systems are better networking citizens than others. Depending on your network, you may want to prioritize traffic from certain machines over traffic from other operating systems--especially when the latest Windows worm strikes. Avleen Vig shows how to use pf, altq, and Squid on FreeBSD to shape your bandwidth with respect to the systems you run.
  • Un nouveau comparatif de chargeurs filaires sur les iPhone (MacBidouille)

    Les derniers iPhone sont toujours vendus avec des chargeurs 5W qui ne permettent pas aux batteries de se charger aussi vite qu'elles le pourraient.
    Macworld a réalisé un comparatif de temps de recharge en utilisant plusieurs modèles de chargeurs.

    En résumé, il y a deux catégories, le chargeur 5W et tous les autres. Ce dernier est considérablement plus lent.
    On constate ensuite que sur un iPhone 7 Plus le chargeur d'iPad de 12W fait tout aussi bien que des modèles plus coûteux.

    Sur les modèles 8 et X, on peut en revanche tirer un meilleur parti d'un chargeur 18W comme celui fourni avec les Pixel de Google (sic). Comme vous le voyez, pas la peine de plus de puissance, elle ne sera pas exploitée.

  • Windows 10 Insiders: New Windows 10 Mobile Build Now Available For Phones (AnandTech)

    It was almost two months ago that Microsoft released the first build of Windows 10 for phones. The first build was very basic, and was missing a lot of the Windows 10 functionality that will be coming. If you did want to try it out though, it was limited to just a handful of devices which means that it had a very small audience. Today that is changing, and the new build is available on almost every single Nokia/Microsoft phone made with the big exception of the high end Lumia 930/Icon, as well as the just released Lumia 640XL. Both devices require some new scaling code added to support the display size and resolution.

    But with this build, we really get our first glance at Windows 10 on phones. Many of the core apps have been updated to have a new experience. Project Spartan, which we first saw in the latest Windows 10 desktop build, is now replacing Internet Explorer on the phone as well. Considering the performance delta between mobile CPUs and desktop CPUs, the performance improvements that we have measured in Project Spartan should make an even bigger difference. I will run one of my devices through some benchmarks to see what the new build will offer.

    Also new is the Outlook Mail and Outlook Calendar apps, which are universal Windows apps and will be the same ones found on the desktop too, although they are not yet on the current desktop build, so we will get our first look at them on the small screen. They have a new UI, and the calendar and mail can both be accessed while in the same app rather than having to switch between two. Outlook will now leverage Word for email composition as well, which should drastically improve the experience on mobile.

    The Phone and Messaging apps are also new. Both have new designs, but the Skype integration coming to the Messaging app does not appear to be part of this build. The People and Maps app are also redesigned.

    All of these apps can now be accessed through a new App Switcher, which is accessed the same way as the old one – hold the back button – and it now supports landscape and offers a grid layout on larger devices which have extra screen real estate.

    For anyone who wants to try it out, you must be part of the Windows Insider program, and install the Windows Insider app on your phone, and then sign in with the same MS account as you signed up for the Windows Insider with. Remember though that this is all pre-release software, so you may not want to install this on your personal phone. There are a list of known bugs as well, so be sure to check out the source link if you are interested in installing the new Technical Preview.

    Source: Microsoft

  • Giving Out Replacement Hotel Keys (Schneier on Security)

    It's a tough security trade-off. Guests lose their hotel room keys, and the hotel staff needs to be accommodating. But at the same time, they can't be giving out hotel room keys to anyone claiming to have lost one. Generally, hotels ask to see some ID before giving out a replacement key and, if the guest doesn't have his wallet with him, have someone walk to the room with the key and check their ID.

    This normally works pretty well, but there's a court case in Brisbane right now about a hotel giving a room key to someone who ended up sexually attacking the woman who had rented the room.

    In civil action launched yesterday, the woman alleges the man was given the spare access key to her room by a hotel staffer.

    The article doesn't say what kind of authentication the hotel requested or received.

  • MAINGEAR Launches R2 Razer Edition: Mini-ITX System with AMD Ryzen or Intel Core i7 (AnandTech)

    MAINGEAR this week introduced the first small form-factor Razer Edition desktop aimed at loyal clients of Razer. The new MAINGEAR R2 Razer Edition uses AMD’s and Intel’s latest platforms and comes with a lot of green lights, green coolant, and other green features to reflect the company’s main color.

    Razer has made quite a name for itself over the years in the gaming laptop market, but instead of entering the desktop business, the company decided to collaborate with renowned system builders to produce "Razer Edition" PCs. This enables Razer to offer Razer-branded desktops customers without entering a highly competitive market, whereas its partners gain access to Razer’s customer base. So far, Razer has collaborated with Lenovo and MAINGEAR for tower gaming desktops aiming mainstream and no-compromise gamers. With the MAINGEAR R2 Razer Edition, the two companies offer something for those who are looking for a miniature system featuring extreme components with further overclocking potential and liquid cooling.

    The MAINGEAR R2 Razer Edition is a Mini-ITX desktop that can fit in a motherboard based on AMD’s B350 or Intel’s Z270 chipset as well as an AMD Ryzen R5/R7 or Intel Core i5/i7 CPU respectively. Keeping the form-factor in mind, the R2 Razer desktop can fit in one graphics card (up to NVIDIA’s Titan Xp), one 3.5” or two 2.5” storage devices, as well as one M.2 PCIe 3.0 x4 NVMe SSD. Unlike many contemporary gaming desktops, the MAINGEAR R2 can accommodate a 5.25” ODD, and when equipped with an appropriate drive, can playback Blu-ray disks.

    When it comes to the motherboard choice, MAINGEAR offers ASRock AB350 Gaming-ITX/ac for use with AMD's Ryzen processors or ASUS ROG Strix Z270I Gaming or MSI Z270I Gaming Pro Carbon AC for Intel’s Core i7 CPUs. All of the motherboards feature GbE, 802.11ac Wi-Fi, Bluetooth 4.2, 7.1-channel audio, as well as USB 3.1 connectivity. MAINGEAR’s product brochure for the R2 also mentions ASRock’s X99 Mini-ITX motherboard, but at this point, it is impossible to order such a system, which is not surprising as this is an outgoing platform.

    Cooling is crucially important for high performance gaming PCs and MAINGEAR offers many options for the R2 Razer Edition. For entry-level builds, MAINGEAR can install AMD’s or Intel’s retail CPU coolers and keep stock cooling systems on the GPU. For something more advanced, the company offers the closed loop EPIC 240 LCS for the CPU. For high-end configurations MAINGEAR can also build a custom open loop LCS for both the CPU and GPU featuring soft tubing and a 360 mm radiator, whereas for ultra-high-end builds the PC maker can design a custom LCS with crystal or metal hardline tubing, chrome fittings, and other stylish components.

    MAINGEAR’s R2 Razer Edition desktops are now available from the company’s web site. Entry-level machines featuring AMD's Ryzen R5 or Intel's Core i5 start at $1099 and $1199, respectively. Meanwhile, SuperStock configurations featuring a customized LCS with hardline tubing and top-of-the-range CPUs and GPUs start at $4299 or $4399 depending on the platform.

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  • Mises à jour et téléchargements de la semaine (Génération NT: logiciels)
    Comme tous les dimanches, retrouvez notre résumé des mises à jour et téléchargements de la semaine.
  • La bulle spéculative sur les anciens produits Apple semble prendre fin (MacBidouille)

    Lors d'une vente aux enchères, le clou du spectacle était un Apple I fonctionnel.

    Il était accompagné de tous ses accessoires, chose très prisée des collectionneurs.

    Ces dernières années de tels produits sont partis à des sommes très très élevées.
    Celui-là a été adjugé 110 000 euros, cinq fois moins que son équivalent en 2013.

    La bulle spéculative sur les produits ayant marqué l'histoire d'Apple semble bel et bien en train de dégonfler.

  • The Enermax Revolution SFX 650W PSU Review: Compact & Capable (AnandTech)

    High performance SFX PSUs are gaining ground on the market and Enermax joins the train with the Revolution SFX series. The Revolution SFX units are modular, 80Plus Gold certified and boasting impressive performance specifications that rival these of current ATX designs. The Revolution SFX units are available in just two variations, the ERV550SWT and the ERV650SWT, and we are having a close look at the more powerful 650W version in this review.

  • AMD Releases Catalyst 15.4 Beta Drivers (AnandTech)

    In a busy day for video card drivers ahead of the Grand Theft Auto V launch, AMD has also released an updated driver set in preparation for release of the game.

    Released in beta form, Catalyst 15.4 (display driver ver. 14.502.1014) is AMD’s GTA V launch driver and contains all of their latest optimizations and profiles for the game, including enabling Crossfire support. Along with the GTA improvements, Catalyst 15.4 also brings with it new or updated Crossfire profiles for several other games (including Battlefield Hardline and Metal Gear Solid V: GZ), and bug fixes for Battlefield 4, Battlefield Hardline, and Far Cry 4.

    Meanwhile for Windows 10 users, as with NVIDIA’s release today you’ll want to avoid these drivers if you want WDDM 2.0 support. Officially these drivers only support up to Windows 8.1 and are not WDDM 2.0 enabled.

    As always, you can grab the drivers for all current desktop, mobile, and integrated AMD GPUs over at AMD’s Catalyst beta download page.